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Programming the future
LATEST NEWS
GoAI Poster (20200827) for Korea
2020-09-21
GOWIN Semiconductor Launches GoAI 2.0 for Embedded Machine Learning Inference   SAN JOSE, Calif. and GUANGZHOU, China, September 21, 2020 - GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, releases the latest version of their GoAI machine learning platform, providing an SDK and accelerator to perform machine learning for edge inference using convolutional neural networks on GOWIN FPGAs.  GOWIN GoAI 2.0 offers direct integration into the TensorFlow and TensorFlow Lite Machine Learning Platforms, optimization for targeting GOWIN’s GW1NSR4P µSoC FPGA, and an accelerator to offload compute-intensive functions from the microcontroller embedded within GOWIN FPGAs with additional 80x performance.   Machine Learning is a rapidly developing field and development is aligning on frameworks, platforms, models, and datasets for better standardization, reliability, and ease of development.  TensorFlow has become one of these aligning platforms and has included support for embedded SoC’s and microcontrollers.  GoAI 2.0 adds the necessary additions to easily use TensorFlow with embedded FPGAs from GOWIN.   “GoAI 2.0 has several important updates for deploying machine learning models onto edge focused, embedded FPGAs,”  said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.  “We can use GoAI 2.0 to deploy reasonably sized and standardized machine learning models such as Mobilenet onto our GW1NSR4P µSoC FPGA.  The GW1NSR4P is perfect for performing TinyML inference at the edge using TensorFlow Lite for Microcontrollers because it includes a hardened ARM Cortex-M3 microcontroller for direct model porting and control of the GoAI accelerator, 4.6K look-up tables of FPGA fabric to instantiate the GoAI 2.0 accelerator and connect sensor inputs as well as an additional 8MB of SRAM for layer storage all in a low cost 6x6mm QFN48 package.  Our GoAI 2.0 SDK allows our customers to go from TensorFlow to FPGA deployment quickly and easily.”   With GoAI 2.0 no FPGA RTL or microprocessor C/C++ programming is required.  The C/C++ code to drive the accelerator from the ARM Cortex-M processor is generated automatically by the GoAI 2.0 SDK.  The GoAI 2.0 accelerator is offered as an FPGA IP, but is also included as part of pre-generated FPGA bitstreams with various types of sensor inputs.  The GoAI 2.0 accelerator architecture is designed such that only a register map needs to be updated per model layer by the processor and no RTL changes are required to deploy or change the machine learning model used.   While machine learning can have a significant learning curve, GoAI 2.0 offers several starting reference designs with different types of sensor inputs to get started such as cameras, microphones, and accelerometers.  Reference designs include data inference of predicting a sine wave output based on an input value, audio phrase detection for inferring a phrase of “yes” or “no” from a microphone input, and person detection inferring the presence of a human in view of a camera.  Additional reference designs are continuing to be developed including gesture detection which detects the shape a user draws in the air while holding the development board using an accelerometer.  Developers can get started with GoAI 2.0 using one of three GoAI Embedded Development Kits.  The development kits include various sizes of GOWIN FPGAs, sensors to run the reference designs, and other peripherals such as HDMI inputs and outputs for video demonstrations. “Machine Learning edge inference has become mainstream for applications in many marketplaces, including consumer, industrial, and medical,” said Scott Casper, Americas Director of Sales, GOWIN Semiconductor. “The GoAI 2.0 platform enables embedded system engineers to add these advanced features easily into applications at cost-effective prices.  We have many resources available such as reference platforms, development kits, and field support to get engineers started right away”   For more information on GOWIN’s GoAI 2.0 Machine Learning Platform and upcoming webinar, please visit us at https://www.gowinsemi.com/en/market/featured_detail/11/   “Gowin will demonstrate our GoAI 2.0 platform in the coming AI EXPO KOREA,” said by Stanley Tse, Sales Director (Asia) of Gowin Semiconductor Corp and General Manager of Gowin Semiconductor Hong Kong, “ We select AI EXPO KOREA as the first tradeshow to introduce GoAI 2.0 platform for the innovation and leading AI technology in Korea. Gowin GoAI 2.0 provides the most cost effective platform to the edge AI market and our person detection solution has already been selected by Korea customer as next generation platform. Our platform significantly reduces the power consumption and design complexity compared to their current solution.” GOWIN’s GoAI 2.0 solution will be demonstrated at AI EXPO KOREA on October 27-29, 2020 in Hall D, COEX, SEOUL, KOREA. Interested attendees can review the conference details at http://www.aiexpo.co.kr/main   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com  
mipi con 2020 _工作區域 1
2020-08-31
GOWIN SEMICONDUCTOR To Present Using Bluetooth Low Energy with MIPI standards at MIPI DevCon 2020   San Jose, Calif., August 31, 2020 – GOWIN Semiconductor Corp., the world’s fastest growing programmable logic company, will present on how to enable sensors integrated with MIPI standards with Bluetooth LE wireless connectivity on September 23rd 2020 from 7:35-8:05am PDT. MIPI DevCon is an annual event that connects developers with training and education related to MIPI standardization for mobile technologies. The two day event features sessions on key specifications, application examples and use cases in mobile influenced areas such as 5G, automotive, IoT and more. Interested attendees can review the conference details at https://www.mipi.org/devcon/2020 This year GOWIN Semiconductor will present on how MIPI interface standards are being actively integrated new types of mobile IoT products using programmable logic SoCs and Bluetooth Low Energy. https://www.mipi.org/devcon/2020/agenda/mipi-bluetooth-le-leveraging-mobile-technology-wireless-iot-applications MIPI specifications in smartphones have drastically reduced the cost and power of sensors, which has opened opportunities for unique and innovative products in other markets. However, new interfaces and use cases often suffer from initial disconnects in interface support from SoC and microcontrollers. FPGA’s have been used to bridge connectivity gaps between new and old interface standards, but have traditionally lacked other key technologies such as wireless to make them useful as a standalone SoC. Now, new IC’s are being developed which combine the capabilities of microcontrollers, FPGA’s and wireless transceivers at compelling cost, power and size metrics. “New interface adoption is traditionally a long process in the semiconductor industry as IC vendors align on when to integrate new and updated specifications into their next devices,” said Grant Jennings, Director of International Marketing of Gowin Semiconductor Corp. “FPGA’s have traditionally been used to convert between old and new specification standards due to their flexibility, but have often lacked other IP to be used as a standalone SoC. Now, new programmable SoC’s are providing ‘all-in-one’ devices containing Bluetooth Low Energy (LE) transceivers, microprocessors and FPGA fabric in a single chip.”GOWIN Semiconductor’s presentation at MIPI DevCon 2020 will feature use case examples in the wireless IoT space found while helping customers develop applications on the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.   About GOWIN Semiconductor Corp.Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.comCopyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com  
AI EXPO KOREA (20200901)
2020-08-24
GOWIN SEMICONDUCTOR To ATTEND AI EXPO KOREA       Guangzhou, Hong Kong, China, San Jose, Calif., 24 August, 2020 – GOWIN Semiconductor Corp., the world’s fastest growing programmable logic company, will attend AI EXPO KOREA on 27-29 Oct 2020 to demonstrate GOWIN latest GoAI solution at booth number C34 Hall D, COEX, SEOUL, KOREA.   AI EXPO KOREA is the only Artificial Intelligence Expo to meet the future artificial intelligence technology, new trends, new products and the best chance to meet all of Artificial Intelligence that leads the 4th Industrial Revolution. Interested attendees can review the conference details at http://www.aiexpo.co.kr/main   “We choose AI EXPO Korea as the first tradeshow to introduce Gowin GoAI solution for the innovation and leading AI technology of Korea ,” said by Stanley Tse, Sales Director (Asia) of Gowin Semiconductor Corp and General Manager of Gowin Semiconductor Hong Kong, “ Korea is one of the earliest countries to deploy 5G infrastructure worldwide which enables Edge AI market; Gowin GoAI also enables Edge AI application by using Machine Learning Accelerator provided over 80x of performance improvement compared standalone MCU’s; We already have customers in Korea on our GoAI Early Access Program and kick off project with our GW1NS-4C family.”   “We’re excited to show our latest GoAI platform, which makes it easy to deploy machine learning models onto GOWIN FPGAs,” Grant Jennings said, Director of International Marketing for GOWIN Semiconductor Corp.  “Customers can now easily train models in common and open machine learning frameworks such as Tensorflow and then automatically compile and deploy trained models for edge inference.”   In AI EXPO Korea, Gowin will demonstrate the objects detection, audio phases detection and gesture/movement detection solutions based on Gowin GoAI technology. Gowin GoAI provides an embedded artificial intelligence solution for loading trained machine learning models into GOWIN FPGA devices.     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com    
Bluetooth
2020-08-11
GOWIN SEMICONDUCTOR ADDS KOREA CERTIFICATION FOR THEIR BLUETOOTH LOW ENERGY ENABLED µSOC FPGA MODULES     SAN JOSE, Calif. and GUANGZHOU, China, August 12, 2020 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, obtains certification for their GW1NRF-4 µSoC FPGA BLE module for Korea enabling developers with quick and easy end-product integration.     GOWIN Semiconductor is the only company to date providing an FPGA with integrated Bluetooth Low Energy Radio transceiver.  The GW1NRF-4 delivers a new generation of wireless product capabilities for product developers by providing 4.6k LUT FPGA, a 32-bit power-optimized ARC processor and a Bluetooth Low Energy radio within a small 6x6mm QFN package. Additionally, GOWIN offers a small 19x20mm PCB module, which integrates the GW1NRF4 IC, passives, oscillators, antenna, and other components.  This module is now certified for various geographies including Korea through the Korea National Radio Research Agency under Clause 2, Article 58-2 of the Radio Waves Act.     Wireless IC’s are often manufactured as an IC chip  as well as a solderable PCB module.  Integration of the standalone IC requires additional components on the board and certification for each country the product will be sold in.  This creates additional product cost overhead for end-product developers.  Alternatively, some wireless IC manufacturers integrate their chip, passives, oscillators, an antenna, and an interference shield into a single PCB module that is pre-certified. This way the product can be manufactured and sold in various geographies without the need to certify the product.      “Many wireless customers request pre-certified GW1NRF-4 modules over the IC chip itself” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor. “Certifying for each country a wireless product is sold in can be a significant cost and technical knowledge burden for customers. As a result, GOWIN Semiconductor offers pre-certified GW1NRF-4 Bluetooth Low Energy modules that can be easily designed into products without performing additional certification.”     The GOWIN GW1NRF-4 Certified Bluetooth module is 19x20mm in size and includes the GW1NRF-4 device, all required passives, crystal oscillators and an antenna creating a ‘plug and play’ path to enabling products with FPGA and Bluetooth capabilities.     GOWIN will present some of the many GW1NRF-4 BLE enabled FPGA use cases for mobile influenced, IoT and industrial markets at MIPI DevCon 2021.  They will discuss and demonstrate how the use of flexible high speed IO and parallel processing can be used to develop unique end product capabilities.     “As the only integrated BLE programmable logic device in the market, Gowin GW1NRF attracts tremendous customer interests in Asia, especially in IoT space,” said by Stanley Tse, Sales Director (Asia) of Gowin Semiconductor Corp and General Manager of Gowin Semiconductor Hong Kong, “the availability of GW1NRF-4 Certified Bluetooth enables design innovation and further reduce customer products time-to-market.”     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.     For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com     Media Contact: Scott Casper scott@gowinsemi.com  
mmexport1593344831118(1)(1)
2020-06-30
Gowin Semiconductor Bluetooth FPGA wins the 2020 IC Design Achievement Award of the Year at Shanghai Best FPGA Award Ceremony   On June 28, 2020, the China IC Leaders Summit and China IC Design Achievement Awards ceremony was held at the Renaissance Shanghai Zhongshan Park Hotel. This summit was organized by Apencore, EETimes, EDN Electronic Technology Design, ESM International Electronic Business Jointly held, it is one of the largest and most influential summits in the semiconductor industry.   Gowin Semiconductor Corp. (hereinafter referred to as "Gowin Semiconductor") won the "Best of the Year" for its Bluetooth FPGA chip GW1NRF-LV4B-QFN48 with its advanced innovative design concept, excellent performance and outstanding market performance "FPGA/processor" award.   "The China IC Design Achievement Award is the highest award in the Chinese semiconductor industry. The selection was recommended by a team of senior analysts from AspenCore. Thousands of IC design practitioners voted through real-name voting. This time, our Bluetooth FPGA chip won this award. It is our honour that this also represents the recognition of us by people in the semiconductor industry and customers." Mr. Wang Tianping, Chief Technology Officer and Vice President of R&D of Gowin Semiconductor said, "GW1NRF-LV4B-QFN48 is an integrated BLE5.0 low power consumption product that we released at the end of 2019. This product has Bluetooth radio frequency function, internally integrated ARC processor and power management module and has a very high degree of system integration, thereby greatly simplifying the complexity of system design while greatly reducing system power consumption. It can be well applied in IOT, portable wearable devices and other related fields."   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2020 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com                  
GOWIN EDA IP (20200507)
2020-05-07
GOWIN Semiconductor Integrates their latest HDMI/DVI RX and TX IP into GOWIN EDA IP Generator   Click the picture to watch the video     SAN JOSE, Calif. and GUANGZHOU, China, May 25, 2020 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their HDMI/DVI RX and TX IPs in GOWIN EDA’s IP Generator providing low cost video interfacing and connectivity solutions for various embedded applications.   HDMI and DVI is one the most common video interfaces used today. With advancements and performance improvements in semiconductor devices, many solutions have focused on higher data rates for both resolution and frame rate improvements. This has left a significant gap for solutions that don’t need extremely high resolutions or frame rates and are very sensitive to their final end product cost.   As a result, GOWIN has developed HDMI and DVI IPs for both receiving and transmitting video data to target resolutions more common to embedded equipment such as 1080p30 or 1280x800p60. These solutions provide a much lower over all solution cost when compared to ASIC bridges or SoCs that often contain more advanced features than what the end product actually requires. “We have found many opportunities to help our customers reduce BOM cost on kiosks and industrial displays, where frame rate is less critical,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.   GOWIN’s HDMI/DVI IP’s have been seen in a broad range of consumer, industrial, and automotive applications. In some cases, the IP’s are used in low density GOWIN FPGA’s for video bridging from one video interface to another. For example, many industrial and consumer kiosks have an HDMI input which drives a Single-Link or Dual-Link LVDS display directly. As a result, GOWIN has created a reference design specifically for this bridging application, which can scale to FPGAs as small as the GOWIN LittleBee GW1N-1, 1K LUT FPGA. Other display interfaces such as MIPI DSI and DPI can also be targeted.   In other situations, the GOWIN HDMI/DVI IP is used with a larger GOWIN FPGAs to create a custom system-on-chip that includes HDMI interfacing. In these situations, devices can utilize video streams HDMI inputs and outputs to perform graphics and video processing. Specialty devices such as the GOWIN GW2AR18 can provide internal frame buffers using its extended 8MB PSRAM making it great for developing custom video SoCs.   “The market has seen a lack of solutions for embedded equipment display applications,” said Scott Casper, Director of Sales for GOWIN Semiconductor. “GOWIN’s HDMI/DVI IP allows for flexibility in video signal bridging and processing with cost effective product development.”   The GOWIN HDMI RX IP was demonstrated as part of a HDMI to LVDS display solution recently at Embedded World 2020. GOWIN’s HDMI TX IP was also demonstrated as part of their GoAI artificial intelligence solution. These demos showed video processing of HDMI data using GOWIN FPGAs at resolutions of 1280x800p60 and 1920x1080p30 respectively.     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2020 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com  
startup-593305_960_720
2020-04-20
New York Institute of Technology -Vancouver Develops Secure Boot Application for GOWIN SecureFPGA   GOWIN Semiconductor announced their SecureFPGA devices in 2019 which enable hardware PUF (Physically Unclonable Functionality) based security providing a root of trust on their µSoC FPGAs.  Since then, GOWIN has been working with various security technologists to develop use case examples in order to fast track embedded security development on their embedded devices.   NYIT-Vancouver (New York Institute of Technology Vancouver Campus) started developing solutions with GOWIN SecureFPGAs as part of their INCS 870 Cyber Security graduate capstone course As part of this course, students worked with GOWIN to solve general purpose security problems using the GOWIN SecureFPGA µSoC FPGA and developed a secure boot example using the included Intrinsic ID Broadkey security library.   Secure Boot is an industry standard that ensures that any device boots using only software that  is digitally signed and verified by the Original Equipment Manufacturer (OEM). The device may be a PC or an embedded device. Typically, the secure boot process runs over a small amount of boot code prior to any application software. The process involves digital signature verification over the application firmware using an asymmetric key pair.   “After completing this project, students gained valuable experience in embedded system development. The multi-faceted nature of such systems makes it challenging to give students exposure to and experience in all facets of such systems,” said Yunlong Shao, Assistant Professor for the INCS 870 course at NYIT-Vancouver.   “In this capstone project, students used GOWIN’s SecureFPGA system and its Broadkey security library to perform the signature verification process over application firmware using an asymmetric key pair. The use of the Broadkey security library gave students practical experience and a sense of accomplishment, while reinforcing theoretical concepts. The results show that students perceived the project positively and that the learning objectives were met.”   SecureFPGA provides several additional layers of security for the secure boot process.  First, SecureFPGA devices can be factory provisioned so that the root key pair of the device is initialized at the GOWIN factory floor.  Second, the device uses SRAM based PUF technology taking intrinsic silicon properties of their device’s hardware SRAM to regenerate a root key pair rather than storing it in the device.  Third, the private key is protected in a secure enclave that is never available to the developer and can only be accessed through the provided Broadkey security library.   “Secure boot is one of the most common requests we receive for customers wanting to add security capabilities to their embedded products,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.  “Partnering with New York Institute of Technology – Vancouver gave us incredibly valuable insight into our security product offering from graduate students with domain expertise specifically in cybersecurity.”   As a result of this successful capstone project by New York Tech - Vancouver, an example design is now provided at www.gowinsemi.com and can be evaluated using the DK-Start-GW1NSE-2C development kit from GOWIN providing developers an great starting point to integrate application firmware checking in their next product.   Duo Xu, graduate student at New York Tech -Vancouver explained that  “In order to perform a secure boot, the developer needs to provide the start address and the size in bytes of the application firmware that will be verified using a digital signature . In the digital signature generation process, the program will initialize the ID Broadkey security library and generate the digital signature that is stored it in flash memory. As soon as the signature generation process finishes, the secure boot function can be called in any part of the code to regenerate the signature, compare it with the signature stored in flash memory, to verify that the application hasn’t been modified. If the verification is successful, the boot process jumps to the first address of firmware, if not, it shows an error message and jumps into an infinite loop.”   GOWIN Semiconductor looks forward to continuing collaboration projects through their overseas university program that enable successful application starting points for their customers.  For more information on GOWIN Semiconductor and their SecureFPGA product visit www.gowinsemi.com.   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
Bluetooth module CE-RED approved (20200407)
2020-04-07
Gowin Semiconductor Obtains EU-RED Certification for their Bluetooth Low Energy µSoC FPGA Production Modules   SAN JOSE, Calif. and GUANGZHOU, China, April 6, 2020 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, obtains BLE module certification for Europe allowing developers to quickly and easily integrate the GW1NRF-4 µSoC FPGA BLE module into their end-products.     Late last year, GOWIN Semiconductor announced the release of the first FPGA with integrated Bluetooth Low Energy Radio called the GW1NRF-4 delivering a new generation of wireless product capabilities for end-product developers. The device provides a 4.6k LUT FPGA, a 32-bit power-optimized ARC processor and a Bluetooth Low Energy radio in a single 6x6mm QFN package. Since then GOWIN has been actively maturing product and solution support enabling easy and fast customer integration of the device. As a result, GOWIN is now producing pre-certified GW1NRF BLE modules.     Wireless IC’s are often productized by semiconductor manufacturers in two forms. Some developers require integration of the Bluetooth chip itself onto their own system circuit board. In this case, developers are required to certify their circuit board with wireless capabilities in the geography to which the product will be sold. This adds an additional cost burden to end product manufacturers, but with the benefit of having more flexibility on the chip integration. Another option is to integrate a PCB module instead that is already certified. The module contains the wireless chip and required circuitry such as decoupling capacitors, oscillators and antennas. The pre-certified PCB module can then be integrated onto a larger system circuit board without recertifying the rest of the system.     “Many wireless customers request pre-certified GW1NRF-4 modules over the chip itself” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor. “Certification for each country a wireless product is intended to be sold in can be a significant cost and technical knowledge burden. As a result, GOWIN Semiconductor offers pre-certified GW1NRF-4 Bluetooth Low Energy modules that can be easily designed into products without performing additional certification.”     The GOWIN GW1NRF-4 Certified Bluetooth module is a 19x20mm module that includes the GW1NRF-4 device, all required passives, crystal oscillators and an antenna creating a ‘plug and play’ path to enabling products with FPGA and Bluetooth capabilities.     GOWIN recently showcased the GW1NRF-4 BLE enabled FPGA at Embedded World 2020 and is continuing to develop unique connectivity examples around the device to quickly enable their customers with Bluetooth FPGA capabilities.     “We are very excited that, following a very successful showcase at Embedded World, we have achieved EU certification for the world’s first Bluetooth enabled FPGA module” said Mike Furnival, Director of EMEA Sales at GOWIN Semiconductor. “Without question, our representatives, distributors, design partners and customers clearly believe that GOWIN’s continued innovation, especially in the IoT space, genuinely adds value in enabling the creation new and differentiated solutions.”     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.     For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com     Media Contact: Scott Casper scott@gowinsemi.com
VHDL PR
2020-04-03
GOWIN Semiconductor Adds VHDL Support to their GOWIN Synthesis FPGA Software for Complete RTL Language Support   SAN JOSE, Calif. and GUANGZHOU, China, March 31, 2020 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces VHDL support for their GOWIN Synthesis FPGA development software enabling customers to use VHDL, Verilog, System-Verilog or mixed languages for RTL design entry.   In 1982, VHDL was originally developed at the behest of the U.S Department of Defense in order to document the behavior of the ASICs and later was adopted by IEEE 1076-1987 as a standard hardware description language. Since then, VHDL has been widely used in developing FPGA and ASIC designs. By adding VHDL support, the GOWIN Synthesis now supports complete RTL Languages for their FPGA designs.   “Supporting VHDL in GOWIN Synthesis is an important milestone which completes the customer need to use different language including mixed languages to describe their FPGA designs, ” said Dr. Jianhua Liu, Director of Software for GOWIN Semiconductor. “Given the steady feature and quality improvement over the past one year, GOWIN Synthesis has been adopted by many customers and has received positive feedback. The VHDL support will eable more FPGA designers to take advantage of the advanced GOWIN Synthesis tool. ”   GOWIN 1.9.5 release provides the VHDL/mixed-language support feature in GOWIN Synthesis, as well as SynlifyPro. GOWIN EDA software will continue to enhance the device support, quality of result, and designer usability.   About GOWIN Semiconductor Corp.   Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2020 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com