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Programming the future
LATEST NEWS
USB-01
2021-05-14
GOWIN Releases USB 2.0 PHY and Device Controller IP for Their FPGA Products   SAN JOSE, Calif. and GUANGZHOU, China, May 17, 2021 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their USB 2.0 Interfacing Solution, allowing GOWIN FPGA designers to easily integrate USB 2.0 connectivity without the need for additional silicon devices.  GOWIN’s solution extends its broad support for USB connectivity over a large range of consumer, automotive, industrial, and communication applications.   According to BusinessWire, a Berkshire Hathaway Company, the market for USB devices has grown to over 30B USD making it one of the most widely used electrical interface standards in the world.  FPGA’s are known for high-speed IO interface flexibility as well as their ability to pipeline data processing with arithmetic logic elements.  However, no FPGA company to date has been able to cost-effectively interface an FPGA directly to USB 2.0 due to its data rate, clock recovery, and IO requirements.  As a result, product manufacturers have been limited to custom ASICs, feature limited microcontrollers, or expensive SoCs in order to enable USB 2.0 support.   “Getting data into and out of our FPGA products effortlessly is one of the most critical architectural considerations our customers encounter,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.  “Built-in USB 2.0 support for our devices is an essential step to enable new product innovations as well as provide a stable path for BOM cost reduction, multi-component integration, and end of life component replacement.”   The new GOWIN USB 2.0 interfacing solution eliminates the need for external PHYs, which were previously required to achieve USB HS (high speed) 480Mbps data rates.  Popular applications include bridging to other peripherals such as JTAG, SPI, and I2S, communicating with MIPI CSI-2 cameras and DSI displays, developing USB hubs, data traffic monitors and recorders, Bluetooth LE, and security dongles.   “We are excited to be the first to bring this long-awaited interconnect capability to the market,” said Scott Casper, Director of Sales, Americas, GOWIN Semiconductor,” FPGA design engineers and embedded system architects can now easily create their bridging solutions with our programmable FPGA products without worrying about limitations of off the shelf products and supply chain constraints.”   GOWIN Semiconductor has been pathing the way for innovative new FPGA products for several years now and the release of their USB 2.0 interfacing solution is the latest edition to this success. The solution includes a USB v2.0 soft PHY as well as a USB v2.0 Device Controller IP, which are included in GOWIN’s EDA Software’s IP Core Generator.  The USB 2.0 IPs are available free of charge with all GOWIN FPGA products.  A reference design, as well as development boards, are available, which instantiate the USB 2.0 IP cores along with a USB 2.0 to UART bridging example to get started.  The IP cores support almost all GOWIN FPGAs and provide a line rate of 480Mbps in High-Speed mode per the USB 2.0 specification.   “This latest release of a soft USB2.0 PHY from GOWIN continues to provide added value for customers in the low and mid-density FPGA space,” said Mike Furnival, Vice President of International Sales. “We are proud that GOWIN is committed to providing some of the most innovative and creative solutions while continuing to support some of the lowest costs and best availabilities in the industry”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2021 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com  
Embedded World 2021
2021-02-26
GOWIN Semiconductor to attend Embedded World 2021 Digital   London, UK and Guangzhou, China 26th February 2021. GOWIN Semiconductor Corporation, the world’s fastest growing FPGA provider, is delighted to announce that it is participating in Embedded World 2021 Digital during 1-5 March. Following on from our highly successful first time attendance in February 2020, GOWIN is joining an impressive list of industry participants who are taking advantage of ew21 digital’s highly developed digital platform to showcase our latest products and solutions to the embedded marketplace.   Embedded World, held annually in Germany, remains Europe’s predominant trade show for all embedded solutions and technologies. This year, without the ability to a host a person-to-person event the organising body at the Nurnberg Messe has done a tremendous job to pull together what we all believe will be a valuable contribution to the industry and an excellent opportunity for vendors, partners, and customer to get together, albeit virtually. Additionally, as a virtual event, the show in now more open a global audience allowing interested parties from all over the planet to benefit from this word class event   This year GOWIN will be showcasing and demonstrating its leading FPGA solutions including the latest developments to our world class GoAI 2.0 machine learning solution for edge inference, along with advanced solutions for FOC motor control, MIPI, USB and wireless/Bluetooth interfacing, ARM based SoC solutions and automotive all of which are based on GOWIN’s highly integrated, lowest power and lowest cost FPGA devices. Additionally, at the concurrent Embedded World conference, GOWIN’s Director of International Marketing, Grant Jennings, will conducting a class on “Developing Artificial Intelligence Using Machine Learning at the Edge with Embedded uSoC FPGAs” on Thursday 4th March at 13.30 CET.   “Given the obvious challenges posed by the global pandemic we are very pleased to be able to participate in this exciting virtual event Embedded World 21” said Mike Furnival, Director of Sales and General Manager of GOWIN Semiconductor in Europe. “It’s a testament to the continued progress we have made during the past year in terms of differentiated FPGA solutions and whilst we remain as the lowest cost provider of low and mid density FPGA devices, we have now emerged as one the most innovative in terms of advanced solutions in the marketplace, adding significant value to our customers and partners.”   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
Automotive grade
2021-01-27
GOWIN Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability   SAN JOSE, Calif. and GUANGZHOU, China, January 25, 2021 - GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, is pleased to announce the release of its new Automotive Grade FPGAs, targeting applications for telematics, infotainment, and the powertrain. AEC-Q100 has been in place for over 20 years defining the reliability qualification requirements for Automotive integrated circuits.  To get a certificate meeting the AEC-Q100 Grade 2 requirements, a manufacturer is required to submit a product to extreme environmental challenges.  GOWIN has submitted and passed all the requirements for their following devices:  GW1N-LV4QN88A4, GW2A-LV18QN88A6, GW2A-LV18PG256A6.  In addition, GOWIN’s Ultra Low Power GW1NZ-LV1QN48A4 will complete AEC-Q100 qualification in Q3’2021.   GOWIN’s success with mainstream FPGAs is now extended to its Automotive Grade products.  Active implementations with these low cost, small size devices include 360-degree surround view, smart cockpit, and vehicle control system.    “We are pleased to bring our low cost, small size, and low power FPGA products to the automotive segment,” said Scott Casper, Director of Sales, GOWIN Semiconductor.  “We continue to increase our presence in expanding marketplaces offering easy to use solutions for embedded system designers.”   For more information about GOWIN’s Automotive Grade products or any of their low-power, small size, low-cost FGPA devices, please visit www.gowinsemi.com.   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com  
MOUSER
2020-12-10
Mouser Electronics Signs Global Distribution Agreement with GOWIN   December 15, 2020 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, announces a global distribution agreement with GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company. GOWIN’s products are designed to provide small-size and low-power solutions to the marketplace.   GOWIN LittleBee® GW1NR-9 FPGAs allow for more efficiency with onboard pseudostatic RAM (PSRAM) and high-speed data rates. Based on 55nm LP technology, the GW1NR-9 FPGAs offer low power consumption, instant-on functionality, high security, and intensive inputs and outputs (I/O).   The DK-START-GW1NSE2 development kit is designed for GW1NS-2C SoC FPGAs, which embed an Arm® Cortex®-M3 processor with a 2K LUT FPGA fabric and a hardware root of trust keypair capability for security functions like secure boot, secure download, and platform resiliency. The development kit includes LVDS and GPIO interfaces, as well as an external USB Type-C interface, clock, LEDs, and other peripherals.   The DK-START-GW1NS2 V2.1 development kit is designed to evaluate the operation and performance of the GW1NS-2 SoC FPGAs. The GW1NS-2 FPFA embeds an Arm Cortex-M3 processor, USB 2.0 PHY, 32 Mbits of PSRAM, 1 Mbit of user flash memory, and an eight-channel analog-to-digital converter (ADC). The kit also offers MIPI/LVDS interfaces, GPIO interfaces, USB Type-C, and a seven-segment digital tube display.   The DK-START-GW2A55-PG484 development kit is designed to evaluate the Arora® GW2A-LV55PG484 FPGA’s high-performance DSP resources, high-speed LVDS interface, and many BSRAM memory resources. The kit provides high-speed data storage based on DDR3, and a high-speed communication test based on MIPI, LVDS, and Gigabit Ethernet (GbE).   To learn more about the GOWIN products available from Mouser, visit https://www.mouser.com/manufacturer/gowin/.   As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.   About Mouser Electronics Mouser Electronics, a Berkshire Hathaway company, is an authorized semiconductor and electronic component distributor focused on New Product Introductions from its leading manufacturer partners. Serving the global electronic design engineer and buyer community, the global distributor's website, mouser.com, is available in multiple languages and currencies and features more than 5 million products from over 1,100 manufacturer brands. Mouser offers 27 support locations worldwide to provide best-in-class customer service in local language, currency and time zone. The distributor ships to over 630,000 customers in 223 countries/territories from its 1 million-square-foot, state-of-the-art distribution facilities in the Dallas, Texas, metro area. For more information, visit https://www.mouser.com/.   About Gowin Semiconductor Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. The company focuses on optimizing their products and removing barriers for customers using programmable logic devices. Gowin’s commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. The company’s offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. Gowin strives to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.     Trademarks Mouser and Mouser Electronics are registered trademarks of Mouser Electronics, Inc. All other products, logos, and company names mentioned herein may be trademarks of their respective owners.       Further information, contact: Kevin Hess, Mouser Electronics Senior Vice President of Marketing +1 (817) 804-3833 Kevin.Hess@mouser.com For press inquiries, contact: Kelly DeGarmo, Mouser Electronics Manager, Corporate Communications and Media Relations +1 (817) 804-7764 Kelly.DeGarmo@mouser.com
GoAI Poster (20200827) for Korea
2020-09-21
GOWIN Semiconductor Launches GoAI 2.0 for Embedded Machine Learning Inference   SAN JOSE, Calif. and GUANGZHOU, China, September 21, 2020 - GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, releases the latest version of their GoAI machine learning platform, providing an SDK and accelerator to perform machine learning for edge inference using convolutional neural networks on GOWIN FPGAs.  GOWIN GoAI 2.0 offers direct integration into the TensorFlow and TensorFlow Lite Machine Learning Platforms, optimization for targeting GOWIN’s GW1NSR4P µSoC FPGA, and an accelerator to offload compute-intensive functions from the microcontroller embedded within GOWIN FPGAs with additional 80x performance.   Machine Learning is a rapidly developing field and development is aligning on frameworks, platforms, models, and datasets for better standardization, reliability, and ease of development.  TensorFlow has become one of these aligning platforms and has included support for embedded SoC’s and microcontrollers.  GoAI 2.0 adds the necessary additions to easily use TensorFlow with embedded FPGAs from GOWIN.   “GoAI 2.0 has several important updates for deploying machine learning models onto edge focused, embedded FPGAs,”  said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.  “We can use GoAI 2.0 to deploy reasonably sized and standardized machine learning models such as Mobilenet onto our GW1NSR4P µSoC FPGA.  The GW1NSR4P is perfect for performing TinyML inference at the edge using TensorFlow Lite for Microcontrollers because it includes a hardened ARM Cortex-M3 microcontroller for direct model porting and control of the GoAI accelerator, 4.6K look-up tables of FPGA fabric to instantiate the GoAI 2.0 accelerator and connect sensor inputs as well as an additional 8MB of SRAM for layer storage all in a low cost 6x6mm QFN48 package.  Our GoAI 2.0 SDK allows our customers to go from TensorFlow to FPGA deployment quickly and easily.”   With GoAI 2.0 no FPGA RTL or microprocessor C/C++ programming is required.  The C/C++ code to drive the accelerator from the ARM Cortex-M processor is generated automatically by the GoAI 2.0 SDK.  The GoAI 2.0 accelerator is offered as an FPGA IP, but is also included as part of pre-generated FPGA bitstreams with various types of sensor inputs.  The GoAI 2.0 accelerator architecture is designed such that only a register map needs to be updated per model layer by the processor and no RTL changes are required to deploy or change the machine learning model used.   While machine learning can have a significant learning curve, GoAI 2.0 offers several starting reference designs with different types of sensor inputs to get started such as cameras, microphones, and accelerometers.  Reference designs include data inference of predicting a sine wave output based on an input value, audio phrase detection for inferring a phrase of “yes” or “no” from a microphone input, and person detection inferring the presence of a human in view of a camera.  Additional reference designs are continuing to be developed including gesture detection which detects the shape a user draws in the air while holding the development board using an accelerometer.  Developers can get started with GoAI 2.0 using one of three GoAI Embedded Development Kits.  The development kits include various sizes of GOWIN FPGAs, sensors to run the reference designs, and other peripherals such as HDMI inputs and outputs for video demonstrations. “Machine Learning edge inference has become mainstream for applications in many marketplaces, including consumer, industrial, and medical,” said Scott Casper, Americas Director of Sales, GOWIN Semiconductor. “The GoAI 2.0 platform enables embedded system engineers to add these advanced features easily into applications at cost-effective prices.  We have many resources available such as reference platforms, development kits, and field support to get engineers started right away”   For more information on GOWIN’s GoAI 2.0 Machine Learning Platform and upcoming webinar, please visit us at https://www.gowinsemi.com/en/market/featured_detail/11/   “Gowin will demonstrate our GoAI 2.0 platform in the coming AI EXPO KOREA,” said by Stanley Tse, Sales Director (Asia) of Gowin Semiconductor Corp and General Manager of Gowin Semiconductor Hong Kong, “ We select AI EXPO KOREA as the first tradeshow to introduce GoAI 2.0 platform for the innovation and leading AI technology in Korea. Gowin GoAI 2.0 provides the most cost effective platform to the edge AI market and our person detection solution has already been selected by Korea customer as next generation platform. Our platform significantly reduces the power consumption and design complexity compared to their current solution.” GOWIN’s GoAI 2.0 solution will be demonstrated at AI EXPO KOREA on October 27-29, 2020 in Hall D, COEX, SEOUL, KOREA. Interested attendees can review the conference details at http://www.aiexpo.co.kr/main   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com  
mipi con 2020 _工作區域 1
2020-08-31
GOWIN SEMICONDUCTOR To Present Using Bluetooth Low Energy with MIPI standards at MIPI DevCon 2020   San Jose, Calif., August 31, 2020 – GOWIN Semiconductor Corp., the world’s fastest growing programmable logic company, will present on how to enable sensors integrated with MIPI standards with Bluetooth LE wireless connectivity on September 23rd 2020 from 7:35-8:05am PDT. MIPI DevCon is an annual event that connects developers with training and education related to MIPI standardization for mobile technologies. The two day event features sessions on key specifications, application examples and use cases in mobile influenced areas such as 5G, automotive, IoT and more. Interested attendees can review the conference details at https://www.mipi.org/devcon/2020 This year GOWIN Semiconductor will present on how MIPI interface standards are being actively integrated new types of mobile IoT products using programmable logic SoCs and Bluetooth Low Energy. https://www.mipi.org/devcon/2020/agenda/mipi-bluetooth-le-leveraging-mobile-technology-wireless-iot-applications MIPI specifications in smartphones have drastically reduced the cost and power of sensors, which has opened opportunities for unique and innovative products in other markets. However, new interfaces and use cases often suffer from initial disconnects in interface support from SoC and microcontrollers. FPGA’s have been used to bridge connectivity gaps between new and old interface standards, but have traditionally lacked other key technologies such as wireless to make them useful as a standalone SoC. Now, new IC’s are being developed which combine the capabilities of microcontrollers, FPGA’s and wireless transceivers at compelling cost, power and size metrics. “New interface adoption is traditionally a long process in the semiconductor industry as IC vendors align on when to integrate new and updated specifications into their next devices,” said Grant Jennings, Director of International Marketing of Gowin Semiconductor Corp. “FPGA’s have traditionally been used to convert between old and new specification standards due to their flexibility, but have often lacked other IP to be used as a standalone SoC. Now, new programmable SoC’s are providing ‘all-in-one’ devices containing Bluetooth Low Energy (LE) transceivers, microprocessors and FPGA fabric in a single chip.”GOWIN Semiconductor’s presentation at MIPI DevCon 2020 will feature use case examples in the wireless IoT space found while helping customers develop applications on the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.   About GOWIN Semiconductor Corp.Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.comCopyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com  
AI EXPO KOREA (20200901)
2020-08-24
GOWIN SEMICONDUCTOR To ATTEND AI EXPO KOREA       Guangzhou, Hong Kong, China, San Jose, Calif., 24 August, 2020 – GOWIN Semiconductor Corp., the world’s fastest growing programmable logic company, will attend AI EXPO KOREA on 27-29 Oct 2020 to demonstrate GOWIN latest GoAI solution at booth number C34 Hall D, COEX, SEOUL, KOREA.   AI EXPO KOREA is the only Artificial Intelligence Expo to meet the future artificial intelligence technology, new trends, new products and the best chance to meet all of Artificial Intelligence that leads the 4th Industrial Revolution. Interested attendees can review the conference details at http://www.aiexpo.co.kr/main   “We choose AI EXPO Korea as the first tradeshow to introduce Gowin GoAI solution for the innovation and leading AI technology of Korea ,” said by Stanley Tse, Sales Director (Asia) of Gowin Semiconductor Corp and General Manager of Gowin Semiconductor Hong Kong, “ Korea is one of the earliest countries to deploy 5G infrastructure worldwide which enables Edge AI market; Gowin GoAI also enables Edge AI application by using Machine Learning Accelerator provided over 80x of performance improvement compared standalone MCU’s; We already have customers in Korea on our GoAI Early Access Program and kick off project with our GW1NS-4C family.”   “We’re excited to show our latest GoAI platform, which makes it easy to deploy machine learning models onto GOWIN FPGAs,” Grant Jennings said, Director of International Marketing for GOWIN Semiconductor Corp.  “Customers can now easily train models in common and open machine learning frameworks such as Tensorflow and then automatically compile and deploy trained models for edge inference.”   In AI EXPO Korea, Gowin will demonstrate the objects detection, audio phases detection and gesture/movement detection solutions based on Gowin GoAI technology. Gowin GoAI provides an embedded artificial intelligence solution for loading trained machine learning models into GOWIN FPGA devices.     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com    
Bluetooth
2020-08-11
GOWIN SEMICONDUCTOR ADDS KOREA CERTIFICATION FOR THEIR BLUETOOTH LOW ENERGY ENABLED µSOC FPGA MODULES     SAN JOSE, Calif. and GUANGZHOU, China, August 12, 2020 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, obtains certification for their GW1NRF-4 µSoC FPGA BLE module for Korea enabling developers with quick and easy end-product integration.     GOWIN Semiconductor is the only company to date providing an FPGA with integrated Bluetooth Low Energy Radio transceiver.  The GW1NRF-4 delivers a new generation of wireless product capabilities for product developers by providing 4.6k LUT FPGA, a 32-bit power-optimized ARC processor and a Bluetooth Low Energy radio within a small 6x6mm QFN package. Additionally, GOWIN offers a small 19x20mm PCB module, which integrates the GW1NRF4 IC, passives, oscillators, antenna, and other components.  This module is now certified for various geographies including Korea through the Korea National Radio Research Agency under Clause 2, Article 58-2 of the Radio Waves Act.     Wireless IC’s are often manufactured as an IC chip  as well as a solderable PCB module.  Integration of the standalone IC requires additional components on the board and certification for each country the product will be sold in.  This creates additional product cost overhead for end-product developers.  Alternatively, some wireless IC manufacturers integrate their chip, passives, oscillators, an antenna, and an interference shield into a single PCB module that is pre-certified. This way the product can be manufactured and sold in various geographies without the need to certify the product.      “Many wireless customers request pre-certified GW1NRF-4 modules over the IC chip itself” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor. “Certifying for each country a wireless product is sold in can be a significant cost and technical knowledge burden for customers. As a result, GOWIN Semiconductor offers pre-certified GW1NRF-4 Bluetooth Low Energy modules that can be easily designed into products without performing additional certification.”     The GOWIN GW1NRF-4 Certified Bluetooth module is 19x20mm in size and includes the GW1NRF-4 device, all required passives, crystal oscillators and an antenna creating a ‘plug and play’ path to enabling products with FPGA and Bluetooth capabilities.     GOWIN will present some of the many GW1NRF-4 BLE enabled FPGA use cases for mobile influenced, IoT and industrial markets at MIPI DevCon 2021.  They will discuss and demonstrate how the use of flexible high speed IO and parallel processing can be used to develop unique end product capabilities.     “As the only integrated BLE programmable logic device in the market, Gowin GW1NRF attracts tremendous customer interests in Asia, especially in IoT space,” said by Stanley Tse, Sales Director (Asia) of Gowin Semiconductor Corp and General Manager of Gowin Semiconductor Hong Kong, “the availability of GW1NRF-4 Certified Bluetooth enables design innovation and further reduce customer products time-to-market.”     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.     For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com     Media Contact: Scott Casper scott@gowinsemi.com  
mmexport1593344831118(1)(1)
2020-06-30
Gowin Semiconductor Bluetooth FPGA wins the 2020 IC Design Achievement Award of the Year at Shanghai Best FPGA Award Ceremony   On June 28, 2020, the China IC Leaders Summit and China IC Design Achievement Awards ceremony was held at the Renaissance Shanghai Zhongshan Park Hotel. This summit was organized by Apencore, EETimes, EDN Electronic Technology Design, ESM International Electronic Business Jointly held, it is one of the largest and most influential summits in the semiconductor industry.   Gowin Semiconductor Corp. (hereinafter referred to as "Gowin Semiconductor") won the "Best of the Year" for its Bluetooth FPGA chip GW1NRF-LV4B-QFN48 with its advanced innovative design concept, excellent performance and outstanding market performance "FPGA/processor" award.   "The China IC Design Achievement Award is the highest award in the Chinese semiconductor industry. The selection was recommended by a team of senior analysts from AspenCore. Thousands of IC design practitioners voted through real-name voting. This time, our Bluetooth FPGA chip won this award. It is our honour that this also represents the recognition of us by people in the semiconductor industry and customers." Mr. Wang Tianping, Chief Technology Officer and Vice President of R&D of Gowin Semiconductor said, "GW1NRF-LV4B-QFN48 is an integrated BLE5.0 low power consumption product that we released at the end of 2019. This product has Bluetooth radio frequency function, internally integrated ARC processor and power management module and has a very high degree of system integration, thereby greatly simplifying the complexity of system design while greatly reducing system power consumption. It can be well applied in IOT, portable wearable devices and other related fields."   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2020 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com