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Programming the future
Latest News
WPG_PR
2022-02-08
GOWIN Semiconductor appoints WPG as pan-European Distributor   London, United Kingdom, 1st February 2022 --GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, today announces a new strategic partnership by appointing WPG EMEA, part of WPG Holdings, the world’s largest semiconductor distributor, as a pan-European distributor. WPG joins established pan European and Americas distribution partner Rutronik, as well as a number of independent local distributors offering extensive customer choice for service and support.   “We are really excited to be joining forces with WPG at this important time in GOWIN Semiconductor’s corporate development” said Mike Furnival, Vice President of International Sales. “There are clear gaps in the FPGA market as previously established manufacturers in the low and mid-range space focus on higher density solutions. GOWIN’s aggressive pursuit of innovative solutions in these markets coupled with the enthusiasm and drive of WPG should provide our customers with much higher level of service and support.”    “The FPGA market has needed new blood for a very long time, the acquisitions of Altera by Intel and Xilinx by AMD, have created the opportunity for another strong player to enter the market offering customers choice and competition, Gowin certainly fit that profile. The EMEA market has long been regarded as a target rich environment for FPGA and other programmable logic vendors, the technology portfolio of Gowin provides customers access to replacement products for existing designs as well as disruptive solutions for new design opportunities”, commented Nigel Watts, President EMEA for WPG. Watts added, “ WPG EMEA is a demand creation focused distributor building a strong and disruptive technology portfolio, Gowin is a very welcome addition and one we will drive hard and support our customers to the very best of our abilities”. About GOWIN Semiconductor Corp.   Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   About WPG   WPG EMEA BV is a wholly owned subsidiary of WPG Holdings, the world’s largest semiconductor distributor. WPG EMEA was established during 2021 and is focused on a true demand creation strategy and supporting the global activities of WPG.   More detail can be found by visiting the corporate website www.wpgholdings.com or locally at www.wpgemea.com . Alternatively you can mail info@wpgemea.com   Copyright 2021 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
hi-speed-usb-logo
2022-01-27
GOWIN Semiconductor USB 2.0 PHY Interface and Device Controller IPs Achieve USB-IF Certification   SAN JOSE, Calif. and GUANGZHOU, China, Jan. 27, 2022 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corp, the world’s fastest-growing programmable logic company, obtains USB Implementers Forum (USB-IF) certification for its USB 2.0 PHY Interface and Device Controller IPs upon passing compliance testing at Granite River Labs, a USB-IF Authorized Independent Test Lab (ITL).   Earlier last year, GOWIN announced their FPGAs now offer the industry’s first USB 2.0 PHY Interface and complementing USB 2.0 Device Controller IP. GOWIN also announced additional solutions for UVC (Universal Video Class) and UAC (Universal Audio Class) support, a new product line of USB peripheral bridging ASSPs and native OS driver support for a variety of solutions. Additional and expanded solutions are anticipated to be announced over the course of Y2022 showing fast and continuous growth in USB support and capabilities by the company.   GOWIN’s patented USB solutions continue to be designed in to end products, and the USB 1.1 and 2.0 PHY and Device Controller IPs were aggressively tested against the USB 1.1 and 2.0 CTS both by GOWIN and by Granite River Labs (GRL), a USB-IF Authorized Independent Test Lab (ITL). The USB-IF reviewed the compliance test data submitted by GRL and approved certification of GOWIN’s USB 2.0 PHY Interface and Device Controller IPs for Littlebee and Arora FPGA devices, which makes GOWIN the first FPGA company to provide integrated USB 2.0 PHY support and compliance.   “GRL performed USB 2.0 Peripheral Silicon Compliance Testing on GOWIN’s PHY Interface and Device Controller IPs for Littlebee and Arora FPGA products,” said Quintin Anderson, Chief Operating Officer at Granite River Labs. “The products passed the USB-IF Compliance Program’s rigorous test requirements, achieved USB-IF certification, and were added to the Integrator's List in early January 2022.”   “FPGAs in production applications are often more limited in interface connectivity, throughput testing and support than their ability to adequately and efficiently process data. The fully programmable USB interface solutions on GOWIN FPGAs allow product developers to communicate over one of the most common electrical interfaces in the industry,” said Grant Jennings, Senior Director of International Marketing at GOWIN Semiconductor.    “There are still interfaces that FPGAs do not support or that lack compliance. This often results in solutions that do not make it to volume production or have subtle underlying issues in the field. Achieving USB 1.1 and 2.0 certification on our PHY Interface and Device Controller FPGA IPs is a testament to GOWIN’s ability to not only innovate, but support those innovations to production products.”   GOWIN will offer a webinar in Q1Y2022 providing additional information on their FPGAs with USB 2.0 PHY and controller capabilities. It will also cover additional link layer solutions available from GOWIN including UVC (Universal Video Class), UAC (Universal Audio Class), HID (Human Interface Device), USB HSIC (High Speed Inter-Chip), HUB designs and more.For more information about GOWIN, please visit www.gowinsemi.com Copyright 2022 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com
DCIM
2021-12-16
Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests SAN JOSE, Calif. Dec. 16, 2021, GOWIN Semiconductor Corp. and Shanghai Automobile Transmission announced that GOWIN Semiconductor’s automotive-grade FPGAs passed SAIC’s 2500h heat resistance test, high and low heat cycling resistance with load test, heat impact test, vibration impact test, and 30,000km vehicle test.   FPGAs are becoming a required component in automotive development with the increased focus on EVs (Electronic Vehicles) as well as dramatic innovations in Advanced Driving Assistance System (ADAS), Autonomous Driving (AD), LIDAR, In-vehicle Infotainment (IVI) and Driver Information (DI) applications.  As a result, automotive manufacturers are performing independent certification tests on Gowin’s AEC-100Q Automotive qualified devices.   According to Huajing Industry Research Institute, the global automotive semiconductor market is expected to reach $65.1 billion in 2022, accounting for nearly 12% of the global semiconductor market becoming the fastest growing semiconductor segment. FPGAs provide flexibility and parallel processing capabilities resulting in  wide range of uses; especially for the development of autonomous driving technology.  This has significantly increased the FPGA market share in the automotive segment, which is expected exceed $2.5 billion by 2025.   “GOWIN’s automotive-grade FPGA has passed a variety of SAIC’s tests such as heat resistance test, high and low heat cycling resistance with load test, 30,000km vehicle test. and so on,” said Li Yu, chief engineer of Shanghai Automobile Transmission. “GOWIN’s FPGA automotive chips featuring high reliability can largely alleviate the severe shortage of such chips faced by domestic auto companies in these applications, and can be responded by local suppliers quickly with quality technical support.”    TP Wang, chief technology officer of GOWIN Semiconductor, said, “It is quite challenging to reach or approach the failure rate of automotive-grade 0 PPM.  Strict industry standards are abided in the entire quality control of automotive chips including designing, manufacturing, packaging and testing. GOWIN planned its process node selection and design accordingly; our FPGAs have passed the automotive certification and have mass production in several different vehicles being actively manufactured. GOWIN has additional automotive-grade FPGAs under certification and will launch additional automotive-grade chips based on more advanced process node next year.”   Shanghai Automobile Transmission (SAGW) is a wholly owned subsidiary of SAIC Motor, with total assets of ¥17.2 billion, annual sales revenue of over ¥10 billion, and annual sales of more than 3.5 million gear assemblies. In recent years, SAGW has accelerated product structure adjustments, especially increased investment in automatic gearing system. Its DCT360 is the first batch-produced dual-clutch automatic gear with fully independent intellectual property rights in China.   As the only high-tech enterprise with both dry and wet dual-clutch automatic gearing systems in China, SAGW has become an OEM supplier and an important strategic partner of emerging vehicles and famous automobile groups at home and abroad such as SAIC Passenger Cars, SAIC-GM, SAIC Volkswagen, SAIC-GM-Wuling, SAIC Maxus, Dongfeng Nissan, Chery Automobile, BAIC Motor, Hezhong Automobile, etc. At present, SAGW is one of the largest Chinese passenger car production and manufacturing enterprises, with the domestic market share of about 15%.
ISP_pressrelease-01
2021-09-20
GOWIN Semiconductor Enables Education and Hobbyists Development Community   SAN JOSE, CA, September 20, 2021 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces a new user community called Magic Jelly Bean.  Magic Jelly Bean focuses on enabling schools, universities, and hobbyists with access to low-cost 3rd party development boards that are shipped locally along with companion example designs and community forums.   MagicJellyBean.org provides up-to-date information on simple and easy-to-use development boards and tutorials currently featuring the MiniStar development kit loaded with  GOWIN’s GW1NS-4C µSoC FPGA.  It also provides references to purchasing sites through domestic distribution vendors such as Amazon, making local shipping very easy.  Community forums on Reddit and Github Discussions provide a discussion and support platform for students, makers, and hobbyists to assist in project development.   “FPGA’s use programming languages similar to C and C++. However, there is a fundamental architectural difference compared to most other programming languages; all code written is executed at the same time instead of sequentially.  This provides a tremendous amount of computing efficiency and flexibility, but also comes with a small learning curve to effectively utilize,” said Grant Jennings, Senior Director of International Marketing for GOWIN Semiconductor.  “Magic Jelly Bean enables engineers of experience levels to learn the capabilities of GOWIN devices with easy-to-use tools and example designs making FPGA development a trivial and second nature exercise.”   MagicJellyBean.org provides student versions of GOWIN EDA and GOWIN MCU Designer that can be easily downloaded and installed without requesting a license file.  The design software is available on Windows and Linux and allows developers to program both GOWIN FPGAs and microprocessors on the development boards available.  Project files are provided on github, allowing for bug reports, updates, additional reference project submissions, and communication related to the Magic Jelly Bean community itself.   MagicJellyBean.org is an independent site featuring innovative FPGA products from GOWIN.  Current and future GOWIN customers can continue to fulfill their production needs through the existing distribution partners including Mouser (https://www.mouser.com/manufacturer/gowin/product-line/), Edge Electronics (www.edgeelectronics.com), and Rutronik (www.rutronik.com).  World-class application and sales support is always available through the website www.gowinsemi.com or by contacting the local sales representatives directly.   “Adding Amazon Store capability to support educational and hobby users is a natural progression and an excellent complement to our existing well established Distributor partners,” said Mike Furnival, Vice President of International Sales at GOWIN Semiconductor. “In these challenging times for global semiconductor supply taking care of smaller, but nonetheless important, potential future customers remains very important for the development of our industry. As these embryonic entities develop they will, in turn, become customers for our Distributors contriving to create a win-win situation for all involved parties.”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp. with sales and R&D locations worldwide, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2021 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
ISP_pressrelease_blue icon-02-02-02
2021-07-20
GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution   SAN JOSE, Calif. and GUANGZHOU, China, July 20, 2021 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, introduces their ISP (Image Signal Processor) IP portfolio and reference design for GOWIN FPGAs. The GOWIN ISP IP core portfolio takes the pixel data from an image sensor and adjusts it through CFA (Color Filter Array/Debayer), CCM (Color Correction Array), Gamma correction, and AE (Auto Exposure) and AWB (Auto White Balance) to provide a clear image balanced in color and brightness.   The GOWIN ISP IP core portfolio is designed to offer camera and device manufacturers the ability to produce affordable camera products with a balanced high-quality picture. Imaging projects often use FPGAs to process imaging data at the streaming data rate as an alternative to fixed-function ISP cores in SoCs (System on Chip).  As a result, GOWIN’s ISP IP core portfolio can be combined with video interface, scalar, and memory controller IP’s to create a complete programmable SoC solution tailored specifically to the needs of the application and product. GOWIN provides the ISP IP cores individually in the GOWIN IP core generator.  It also provides pre-generated IP cores integrated as part of a larger reference design to complete the image processing pipeline.  The reference design also includes an ARM Cortex-M processor to control the image processing pipeline in real-time. "GOWIN ISP can be configured and programmed through the embedded soft processor. It allows users to easily customize functions and tune ISP performance for their specific application scenarios to achieve better visual quality or higher recognition accuracy. I believe it can greatly shorten development and tuning time,” said Thomas Cheng, Director of Solution Development for GOWIN Semiconductor.”   The new GOWIN ISP supports 8bit/10bit image data and provides an adjustable register map for different image sensors and resolutions.  Calibration coefficients can be loaded by the MCU or initialized by the bitstream.  IP modules in the pipeline can be intercepted allowing users to add their custom imaging blocks as needed.   GOWIN Semiconductor has been paving the way for innovative new FPGA products for several years now and the release of their ISP IP core portfolio and reference design is the latest edition to this success. The GOWIN ISP reference design outputs RGB stream with improved image quality for display or recognition purposes which is required for many imaging products.   “This latest release of an ISP solution from GOWIN continues to push the boundaries of affordable low-powered solutions,” said Mike Furnival, Vice President of International Sales. “We are proud that GOWIN is committed to providing some of the most innovative and creative solutions while continuing to support some of the lowest costs and best availabilities in the industry”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2021 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com 408-646-2118
WXWorkCapture_16246015522171
2021-06-29
Gowin Semiconductor announces their GoBridge™ ASSP product line with USB peripheral bridges   SAN JOSE, Calif. and GUANGZHOU, China, June 29, 2021 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, introduces the GoBridge ASSP product line with the release of their GWU2X and GWU2U USB interface bridging devices. The GWU2X ASSP features the conversion of USB (Universal Serial Bus) to 4 peripheral interfaces including SPI, JTAG, I2C, and GPIO, while the GWU2U ASSP converts USB devices to UART. GOWIN’s GoBridge ASSP product line simplifies common interface bridging problems over a large range of consumer, automotive, industrial, and communication markets.   The GWU2X and GWU2U ASSPs leverage state-of-the-art semiconductor technology ideal for providing communication and configuration for new end products. It also is well suited for replacing end-of-life and limited sourced semiconductor devices on existing or next-generation end products. GOWIN aims to minimize development effort by providing fixed-function devices when programmability is not necessary. This improves solution time to market and additional sourcing options to existing ASICs and ASSPs with similar functionality.   “We found that almost all FPGA and MCU development boards use USB to JTAG or USB to UART chips for programming and debugging yet few ASSP’s exist. The result is often high device cost not only for development boards and programming cables but for communication and configuration ports on many electronic end products,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor. “The GWU2X and GWU2U allow for a broader range of bridging vendor options as well as a single-source solution portfolio for our FPGA and MCU customers”   The new GOWIN GoBridge ASSPs provide support for multiple voltage levels including 3.3V, 2.5V, or 1.8V. Both the GWU2X and GWU2U come factory configured, eliminating the need for firmware loading.   “We are pleased to be the first to bring a lower-powered ASSP solution which will save costs and programming time,” said Scott Casper, Director of Sales, Americas, GOWIN Semiconductor, “FPGA design engineers and embedded system architects can now easily use this ASSP bridging solution across several applications with GOWIN’s fully built-in USB protocol processing, without external programming.”   GOWIN Semiconductor has been paving the way for innovative new FPGA products for several years now and the release of their ASSP interfacing solution is the latest edition to this success. The GWU2U and the GWU2X support multiple operating systems and are compatible with GOWIN EDA for FPGA programming. They also provide a C/C++ based API to create USB interface programs. GOWIN also provides USB 1.1 and USB 2.0 PHY and Device Controller IP’s for FPGA users who would want to develop more flexible USB-related solutions.   “This latest release of an ASSP solution from GOWIN continues to provide added value for customers looking at USB bridging solutions,” said Mike Furnival, Vice President of International Sales. “We are proud that GOWIN is committed to providing some of the most innovative and creative solutions while continuing to support some of the lowest costs and best availabilities in the industry”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2021 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
2021-06-25
GOWIN Removed from CCMC List, Withdrawing Lawsuit San Jose, CA and Guangzhou, China - June 25, 2021 – GOWIN Semiconductor Corp, a leading supplier of programmable logic devices, is pleased to announce that the company has been removed from the US Department of Defense list of Communist Chinese Military Companies (“CCMC”). In May 2021, GOWIN filed a lawsuit to challenge its January 14, 2021 listing as a CCMC, asserting that the designation was made in error. As a result of that lawsuit, GOWIN learned that the government’s improper designation was not based on any facts connecting it to the Chinese military or government, and on June 3, 2021, President Biden signed a new Executive Order that directed the removal of that designation. Founded in 2014, GOWIN has been designing and manufacturing semiconductor devices for the consumer, industrial, communication, automotive, and medical markets. With offices and R&D worldwide, GOWIN has established itself as a leading top tier partner for programmable logic devices. GOWIN is committed to innovating, optimizing, and developing the best semiconductor solutions for new and challenging markets.
USB-01
2021-05-14
GOWIN Releases USB 2.0 PHY and Device Controller IP for Their FPGA Products   SAN JOSE, Calif. and GUANGZHOU, China, May 17, 2021 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their USB 2.0 Interfacing Solution, allowing GOWIN FPGA designers to easily integrate USB 2.0 connectivity without the need for additional silicon devices.  GOWIN’s solution extends its broad support for USB connectivity over a large range of consumer, automotive, industrial, and communication applications.   According to BusinessWire, a Berkshire Hathaway Company, the market for USB devices has grown to over 30B USD making it one of the most widely used electrical interface standards in the world.  FPGA’s are known for high-speed IO interface flexibility as well as their ability to pipeline data processing with arithmetic logic elements.  However, no FPGA company to date has been able to cost-effectively interface an FPGA directly to USB 2.0 due to its data rate, clock recovery, and IO requirements.  As a result, product manufacturers have been limited to custom ASICs, feature limited microcontrollers, or expensive SoCs in order to enable USB 2.0 support.   “Getting data into and out of our FPGA products effortlessly is one of the most critical architectural considerations our customers encounter,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.  “Built-in USB 2.0 support for our devices is an essential step to enable new product innovations as well as provide a stable path for BOM cost reduction, multi-component integration, and end of life component replacement.”   The new GOWIN USB 2.0 interfacing solution eliminates the need for external PHYs, which were previously required to achieve USB HS (high speed) 480Mbps data rates.  Popular applications include bridging to other peripherals such as JTAG, SPI, and I2S, communicating with MIPI CSI-2 cameras and DSI displays, developing USB hubs, data traffic monitors and recorders, Bluetooth LE, and security dongles.   “We are excited to be the first to bring this long-awaited interconnect capability to the market,” said Scott Casper, Director of Sales, Americas, GOWIN Semiconductor,” FPGA design engineers and embedded system architects can now easily create their bridging solutions with our programmable FPGA products without worrying about limitations of off the shelf products and supply chain constraints.”   GOWIN Semiconductor has been pathing the way for innovative new FPGA products for several years now and the release of their USB 2.0 interfacing solution is the latest edition to this success. The solution includes a USB v2.0 soft PHY as well as a USB v2.0 Device Controller IP, which are included in GOWIN’s EDA Software’s IP Core Generator.  The USB 2.0 IPs are available free of charge with all GOWIN FPGA products.  A reference design, as well as development boards, are available, which instantiate the USB 2.0 IP cores along with a USB 2.0 to UART bridging example to get started.  The IP cores support almost all GOWIN FPGAs and provide a line rate of 480Mbps in High-Speed mode per the USB 2.0 specification.   “This latest release of a soft USB2.0 PHY from GOWIN continues to provide added value for customers in the low and mid-density FPGA space,” said Mike Furnival, Vice President of International Sales. “We are proud that GOWIN is committed to providing some of the most innovative and creative solutions while continuing to support some of the lowest costs and best availabilities in the industry”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2021 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com  
Embedded World 2021
2021-02-26
GOWIN Semiconductor to attend Embedded World 2021 Digital   London, UK and Guangzhou, China 26th February 2021. GOWIN Semiconductor Corporation, the world’s fastest growing FPGA provider, is delighted to announce that it is participating in Embedded World 2021 Digital during 1-5 March. Following on from our highly successful first time attendance in February 2020, GOWIN is joining an impressive list of industry participants who are taking advantage of ew21 digital’s highly developed digital platform to showcase our latest products and solutions to the embedded marketplace.   Embedded World, held annually in Germany, remains Europe’s predominant trade show for all embedded solutions and technologies. This year, without the ability to a host a person-to-person event the organising body at the Nurnberg Messe has done a tremendous job to pull together what we all believe will be a valuable contribution to the industry and an excellent opportunity for vendors, partners, and customer to get together, albeit virtually. Additionally, as a virtual event, the show in now more open a global audience allowing interested parties from all over the planet to benefit from this word class event   This year GOWIN will be showcasing and demonstrating its leading FPGA solutions including the latest developments to our world class GoAI 2.0 machine learning solution for edge inference, along with advanced solutions for FOC motor control, MIPI, USB and wireless/Bluetooth interfacing, ARM based SoC solutions and automotive all of which are based on GOWIN’s highly integrated, lowest power and lowest cost FPGA devices. Additionally, at the concurrent Embedded World conference, GOWIN’s Director of International Marketing, Grant Jennings, will conducting a class on “Developing Artificial Intelligence Using Machine Learning at the Edge with Embedded uSoC FPGAs” on Thursday 4th March at 13.30 CET.   “Given the obvious challenges posed by the global pandemic we are very pleased to be able to participate in this exciting virtual event Embedded World 21” said Mike Furnival, Director of Sales and General Manager of GOWIN Semiconductor in Europe. “It’s a testament to the continued progress we have made during the past year in terms of differentiated FPGA solutions and whilst we remain as the lowest cost provider of low and mid density FPGA devices, we have now emerged as one the most innovative in terms of advanced solutions in the marketplace, adding significant value to our customers and partners.”   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com