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ABOUT US

Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

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NEWS
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2020-06-30
Gowin Semiconductor Bluetooth FPGA wins the 2020 IC Design Achievement Award of the Year at Shanghai Best FPGA Award Ceremony
  On June 28, 2020, the China IC Leaders Summit and China IC Design Achievement Awards ceremony was held at the Renaissance Shanghai Zhongshan Park Hotel. This summit was organized by Apencore, EETimes, EDN Electronic Technology Design, ESM International Electronic Business Jointly held, it is one of the largest and most influential summits in the semiconductor industry.   Gowin Semiconductor Corp. (hereinafter referred to as "Gowin Semiconductor") won the "Best of the Year" for its Bluetooth FPGA chip GW1NRF-LV4B-QFN48 with its advanced innovative design concept, excellent performance and outstanding market performance "FPGA/processor" award.   "The China IC Design Achievement Award is the highest award in the Chinese semiconductor industry. The selection was recommended by a team of senior analysts from AspenCore. Thousands of IC design practitioners voted through real-name voting. This time, our Bluetooth FPGA chip won this award. It is our honour that this also represents the recognition of us by people in the semiconductor industry and customers." Mr. Wang Tianping, Chief Technology Officer and Vice President of R&D of Gowin Semiconductor said, "GW1NRF-LV4B-QFN48 is an integrated BLE5.0 low power consumption product that we released at the end of 2019. This product has Bluetooth radio frequency function, internally integrated ARC processor and power management module and has a very high degree of system integration, thereby greatly simplifying the complexity of system design while greatly reducing system power consumption. It can be well applied in IOT, portable wearable devices and other related fields."   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2020 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com                  
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GOWIN EDA IP (20200507)
2020-05-07
GOWIN Semiconductor Integrates their latest HDMI/DVI RX and TX IP into GOWIN EDA IP Generator
  Click the picture to watch the video     SAN JOSE, Calif. and GUANGZHOU, China, May 25, 2020 -- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their HDMI/DVI RX and TX IPs in GOWIN EDA’s IP Generator providing low cost video interfacing and connectivity solutions for various embedded applications.   HDMI and DVI is one the most common video interfaces used today. With advancements and performance improvements in semiconductor devices, many solutions have focused on higher data rates for both resolution and frame rate improvements. This has left a significant gap for solutions that don’t need extremely high resolutions or frame rates and are very sensitive to their final end product cost.   As a result, GOWIN has developed HDMI and DVI IPs for both receiving and transmitting video data to target resolutions more common to embedded equipment such as 1080p30 or 1280x800p60. These solutions provide a much lower over all solution cost when compared to ASIC bridges or SoCs that often contain more advanced features than what the end product actually requires. “We have found many opportunities to help our customers reduce BOM cost on kiosks and industrial displays, where frame rate is less critical,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.   GOWIN’s HDMI/DVI IP’s have been seen in a broad range of consumer, industrial, and automotive applications. In some cases, the IP’s are used in low density GOWIN FPGA’s for video bridging from one video interface to another. For example, many industrial and consumer kiosks have an HDMI input which drives a Single-Link or Dual-Link LVDS display directly. As a result, GOWIN has created a reference design specifically for this bridging application, which can scale to FPGAs as small as the GOWIN LittleBee GW1N-1, 1K LUT FPGA. Other display interfaces such as MIPI DSI and DPI can also be targeted.   In other situations, the GOWIN HDMI/DVI IP is used with a larger GOWIN FPGAs to create a custom system-on-chip that includes HDMI interfacing. In these situations, devices can utilize video streams HDMI inputs and outputs to perform graphics and video processing. Specialty devices such as the GOWIN GW2AR18 can provide internal frame buffers using its extended 8MB PSRAM making it great for developing custom video SoCs.   “The market has seen a lack of solutions for embedded equipment display applications,” said Scott Casper, Director of Sales for GOWIN Semiconductor. “GOWIN’s HDMI/DVI IP allows for flexibility in video signal bridging and processing with cost effective product development.”   The GOWIN HDMI RX IP was demonstrated as part of a HDMI to LVDS display solution recently at Embedded World 2020. GOWIN’s HDMI TX IP was also demonstrated as part of their GoAI artificial intelligence solution. These demos showed video processing of HDMI data using GOWIN FPGAs at resolutions of 1280x800p60 and 1920x1080p30 respectively.     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   Copyright 2020 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com   Media Contact: Scott Casper scott@gowinsemi.com  
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2020-04-20
New York Institute of Technology -Vancouver Develops Secure Boot Application for GOWIN SecureFPGA
  GOWIN Semiconductor announced their SecureFPGA devices in 2019 which enable hardware PUF (Physically Unclonable Functionality) based security providing a root of trust on their µSoC FPGAs.  Since then, GOWIN has been working with various security technologists to develop use case examples in order to fast track embedded security development on their embedded devices.   NYIT-Vancouver (New York Institute of Technology Vancouver Campus) started developing solutions with GOWIN SecureFPGAs as part of their INCS 870 Cyber Security graduate capstone course As part of this course, students worked with GOWIN to solve general purpose security problems using the GOWIN SecureFPGA µSoC FPGA and developed a secure boot example using the included Intrinsic ID Broadkey security library.   Secure Boot is an industry standard that ensures that any device boots using only software that  is digitally signed and verified by the Original Equipment Manufacturer (OEM). The device may be a PC or an embedded device. Typically, the secure boot process runs over a small amount of boot code prior to any application software. The process involves digital signature verification over the application firmware using an asymmetric key pair.   “After completing this project, students gained valuable experience in embedded system development. The multi-faceted nature of such systems makes it challenging to give students exposure to and experience in all facets of such systems,” said Yunlong Shao, Assistant Professor for the INCS 870 course at NYIT-Vancouver.   “In this capstone project, students used GOWIN’s SecureFPGA system and its Broadkey security library to perform the signature verification process over application firmware using an asymmetric key pair. The use of the Broadkey security library gave students practical experience and a sense of accomplishment, while reinforcing theoretical concepts. The results show that students perceived the project positively and that the learning objectives were met.”   SecureFPGA provides several additional layers of security for the secure boot process.  First, SecureFPGA devices can be factory provisioned so that the root key pair of the device is initialized at the GOWIN factory floor.  Second, the device uses SRAM based PUF technology taking intrinsic silicon properties of their device’s hardware SRAM to regenerate a root key pair rather than storing it in the device.  Third, the private key is protected in a secure enclave that is never available to the developer and can only be accessed through the provided Broadkey security library.   “Secure boot is one of the most common requests we receive for customers wanting to add security capabilities to their embedded products,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor.  “Partnering with New York Institute of Technology – Vancouver gave us incredibly valuable insight into our security product offering from graduate students with domain expertise specifically in cybersecurity.”   As a result of this successful capstone project by New York Tech - Vancouver, an example design is now provided at www.gowinsemi.com and can be evaluated using the DK-Start-GW1NSE-2C development kit from GOWIN providing developers an great starting point to integrate application firmware checking in their next product.   Duo Xu, graduate student at New York Tech -Vancouver explained that  “In order to perform a secure boot, the developer needs to provide the start address and the size in bytes of the application firmware that will be verified using a digital signature . In the digital signature generation process, the program will initialize the ID Broadkey security library and generate the digital signature that is stored it in flash memory. As soon as the signature generation process finishes, the secure boot function can be called in any part of the code to regenerate the signature, compare it with the signature stored in flash memory, to verify that the application hasn’t been modified. If the verification is successful, the boot process jumps to the first address of firmware, if not, it shows an error message and jumps into an infinite loop.”   GOWIN Semiconductor looks forward to continuing collaboration projects through their overseas university program that enable successful application starting points for their customers.  For more information on GOWIN Semiconductor and their SecureFPGA product visit www.gowinsemi.com.   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN  Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com
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