New AI-assisted development solution connects compatible AI assistants with the GOWIN EDA toolchain, streamlining workflows from synthesis and implementation to timing analysis, programming, and hardware verification GOWIN Semiconductor Corporation, a leading innovator in Field Programmable Gate Array (FPGA) technology, today announced GOWIN FabricPilot™, a new AI-assisted development solution designed to streamline FPGA design workflows and improve engineering productivity within the GOWIN EDA environment. Built on the Model Context Protocol (MCP), FabricPilot™ enables compatible AI assistants to interact directly with GOWIN's FPGA development tools, allowing engineers to initiate implementation processes, analyze design results, and manage development tasks through natural-language instructions. With 47 integrated tools spanning eight functional areas, FabricPilot™ supports a wide range of FPGA development activities, including project management, design configuration, synthesis, place-and-route, timing analysis, hardware programming, simulation comparison, and technical documentation retrieval. Bringing AI Assistance into FPGA Development   FPGA development involves multiple stages of design implementation, analysis, and verification, often requiring engineers to navigate complex tool environments and interpret detailed reports. GOWIN FabricPilot™ introduces an AI-assisted approach by connecting compatible AI development environments with the existing GOWIN EDA toolchain through a standardized MCP interface. Through supported MCP-compatible AI clients, engineers can use natural-language instructions to configure projects, initiate synthesis and place-and-route processes, retrieve implementation reports, and examine potential design improvements. Rather than functioning solely as a code-generation or documentation assistant, FabricPilot™ enables AI clients to interact with the actual FPGA development toolchain, supporting engineering workflows across multiple stages of the design process. By integrating AI assistance into established development workflows, FabricPilot™ aims to reduce time spent on repetitive operations while allowing engineers to focus more attention on design optimization and application development. Extending AI-Assisted Workflows from Design to Hardware   A key capability of GOWIN FabricPilot™ is its ability to extend AI-assisted workflows beyond initial design and implementation tasks into analysis, programming, and hardware verification. The solution integrates with GOWIN's synthesis and place-and-route tools, allowing engineers to initiate implementation processes and retrieve timing, power, and resource utilization results to support design analysis and optimization. FabricPilot™ also integrates with GOWIN Programmer and GOWIN Analyzer Oscilloscope (GAO), extending AI-assisted workflows into FPGA device programming and hardware debugging. Additionally, FabricPilot™ enables engineers to compare simulation waveform data with signals captured from physical FPGA hardware, helping identify discrepancies between expected and actual device behavior. Together, these capabilities connect design implementation, analysis, and hardware verification within a more integrated development workflow, helping engineers identify issues and evaluate design results more efficiently. Local Execution, Privacy, and Engineering Control   Protecting proprietary designs and maintaining control over development processes are important considerations when incorporating AI into engineering environments. GOWIN FabricPilot™ supports local execution and offline installation, with no telemetry enabled by default within the FabricPilot™ component. Design files, execution records, and locally indexed documentation can remain within the user's development environment. The privacy and network behavior of connected AI assistants depend on the selected client, underlying AI model, and its configuration. Engineers can therefore choose an AI environment appropriate for their organization's security and data-handling requirements. FabricPilot™ also maintains traceable execution records, including logs, implementation reports, and generated artifacts, allowing engineers to review development results and investigate issues. For sensitive operations such as device programming, FabricPilot™ incorporates explicit confirmation mechanisms. Design recommendations remain subject to engineering review rather than being automatically applied, helping maintain oversight throughout the development process. Advancing the GOWIN FPGA Development Ecosystem   The introduction of FabricPilot™ represents another step in GOWIN's continued investment in FPGA development tools and engineering accessibility. By connecting AI assistance with established FPGA design and hardware development tools, GOWIN aims to help engineers work more efficiently across the development cycle, from initial project configuration through implementation, analysis, and hardware validation. FabricPilot™ expands GOWIN's development ecosystem as the company continues to support FPGA applications across industrial automation, automotive electronics, communications, video and display, and embedded systems. Availability   GOWIN FabricPilot™ is designed to integrate with supported versions of the GOWIN EDA software environment. Customers will be able to access FabricPilot™ installation resources, supported EDA version requirements, compatible AI client information, and getting-started documentation through GOWIN's official software and support resources. Additional technical guidance and example workflows will help developers configure FabricPilot™ and begin exploring AI-assisted FPGA development. For software downloads and development resources, visit: https://www.gowinsemi.com/en/support/home/ About GOWIN Semiconductor   Founded in 2014, GOWIN Semiconductor Corporation is dedicated to advancing embedded innovation through high-performance, power-efficient FPGA solutions. Serving markets including industrial automation, robotics, consumer electronics, communications, and emerging AR/VR applications, GOWIN provides flexible and scalable platforms that help customers bring differentiated products to market faster. For more information, visit www.gowinsemi.com.

New cooperation supports makers, educators, and commercial teams requiring fast, low-quantity FPGA access Date – April 30, 2026 — GOWIN Semiconductor today announced a collaboration with JLCPCB, a global PCB fabrication and assembly provider, aimed at improving access to FPGA devices for developers requiring fast prototyping, small-volume production, and low-friction hardware development. Through this cooperation, selected GOWIN FPGA devices will be available within JLCPCB’s component ecosystem via LCSC, enabling simplified sourcing alongside PCB fabrication and assembly services. This approach allows developers to move efficiently from concept to working hardware, reducing the barriers typically associated with small-quantity FPGA procurement. In addition, GOWIN devices are also becoming available through platforms such as HQchip, further expanding access for customers seeking flexible sourcing options across different procurement channels. The collaboration supports a broad range of users — from makers, students, and open-source developers to commercial engineering teams needing rapid prototyping or low-volume production ahead of scale-up. Initial availability will focus on widely used devices within the open hardware ecosystem, including those commonly deployed in Tang Nano, Tang Mega, and related FPGA development platforms. "This collaboration reflects our commitment to lowering barriers to FPGA adoption," said Mike Furnival, VP of International Sales at GOWIN Semiconductor. "By cooperating with platforms like JLCPCB, we are enabling developers, educators, and engineering teams to prototype and iterate faster, while maintaining a clear and supported path to scalable production." Enabling Fast and Accessible FPGA Development The cooperation with JLCPCB enables rapid prototyping and small-volume builds through integrated PCB fabrication and assembly services. It simplifies access to FPGA devices for makers, students, startups, and commercial R&D teams, while supporting fast hardware iteration without complex sourcing requirements or minimum order constraints.   Supporting Flexible Paths from Prototype to Production GOWIN continues to support customers across the full development lifecycle through a complementary, multi-channel approach. This includes: Collaboration with JLCPCB for convenient prototyping and low-volume production Availability through distribution platforms such as HQchip for flexible component sourcing Direct engagement with GOWIN’s global sales organization for volume production, long-term supply assurance, and technical support Availability Selected GOWIN FPGA devices are expected to become available through JLCPCB’s component ecosystem in the coming months, with additional devices introduced based on community and customer demand.   About GOWIN Semiconductor Corporation   Founded in 2014, GOWIN Semiconductor Corporation is dedicated to advancing embedded innovation through high-performance, power-efficient FPGA solutions. Serving markets including industrial automation, robotics, consumer electronics, communications, and emerging AR/VR applications, GOWIN provides flexible and scalable platforms that help customers bring differentiated products to market faster.

London, UK, and Guangzhou, China, March 9, 2026GW1AN and GW3A Expand GOWIN’s Small and Medium FPGA Portfolio GOWIN Semiconductor today announced the launch of its next-generation Arora GW1AN and GW3A FPGA families, expanding its programmable logic portfolio with compact architectures, efficient integration, and dependable performance across industrial, consumer, and embedded applications.   Designed to support the complete FPGA decision chain — including hardware architects, FPGA developers, engineering managers, and component procurement teams — the new families emphasize migration flexibility, sourcing stability, and long-term production planning across EMEA, the United States, and Japan.   Arora GW1AN: Expanded Small FPGA Integration The Arora GW1AN family introduces an enhanced small FPGA architecture focused on system-level efficiency and integration flexibility. Key features include: Redesigned packaging for improved board compatibility Hardened embedded IP subsystems to reduce development complexity Integrated user flash supporting background programming and multi-image reliability Higher-precision ADC resources for monitoring and control systems Pin-compatible migration paths enabling dual-source and risk mitigation strategies The GW1AN series is positioned for industrial control, embedded processing, power management, and cost-sensitive programmable logic designs where compact footprint and long lifecycle support are essential. GW3A: New Medium FPGA Performance Class The GW3A family introduces a hybrid LUT4/LUT6 FPGA architecture combined with optimized hard IP blocks to deliver balanced performance and efficient silicon utilization. With logic densities ranging from approximately 6K to 90K LUTs, GW3A supports: Industrial automation platforms Machine vision systems Video bridging and display connectivity Embedded interface and control applications The architecture is designed to provide strong integration capability while maintaining footprint efficiency for small to medium programmable designs. Designed for Real-World Engineering Requirements Both FPGA families integrate hardened functional blocks aligned with practical system demands, including: Deterministic timing for motor control and FoC applications MIPI connectivity for imaging and vision systems Flexible display and interface bridging Integrated ADC and DSP resources for power and energy applications These capabilities allow designers to reduce external components, simplify system architecture, and optimize board-level efficiency. Regional Focus and Supply Chain Stability The 2026 portfolio expansion reinforces GOWIN’s commitment to: Strong 3.3V I/O drive capability Simplified configuration flows Alignment with legacy device architectures Predictable production planning These attributes address the sourcing, lifecycle, and supply chain priorities of customers across EMEA, the US, and Japan. Executive Perspective “With the introduction of the Arora GW1AN and GW3A families, we are strengthening GOWIN’s position in both the small and medium FPGA markets,” said Mike Furnival, VP International Sales and GM of the UK Office at GOWIN Semiconductor. “Our customers are asking for integration efficiency, migration flexibility, and dependable production planning. These new families are designed specifically to address those needs while delivering the performance and architectural balance modern embedded systems require.” Availability The Arora GW1AN and GW3A families will roll out throughout 2026, with technical documentation, development tools, and evaluation platforms available through GOWIN’s global support network. For detailed specifications, evaluation hardware, or migration support, please contact your local GOWIN Semiconductor representative or visit the GOWIN Technical Resource Center. About GOWIN Semiconductor Corporation Founded in 2014, GOWIN Semiconductor Corporation is dedicated to advancing embedded innovation through high-performance, power-efficient FPGA solutions. Serving markets including industrial automation, robotics, consumer electronics, communications, and emerging AR/VR applications, GOWIN provides flexible and scalable platforms that help customers bring differentiated products to market faster.