|
GPCN-2022-005_Change of GW2A-LV18MG196 Wirebonding Material |
PCN |
GPCN-2022-005 |
|
2022/11/21 |
PDF |
|
Gowin SDIO Slave Controller RefDesign |
Redesign |
|
|
2022/11/19 |
ZIP |
|
Gowin_EMPU_M3 Hardware Design Refernce Manual |
User Guide |
IPUG923 |
1.2J |
2022/11/18 |
PDF |
|
Gowin FPGA Quick Start Guide of RISCV Programming |
User Guide |
IPUG546 |
1.1J |
2022/11/18 |
PDF |
|
GPCN-2022-004_Tray packing method change to add EPE foam |
PCN |
GPCN-2022-004 |
|
2022/11/09 |
PDF |
|
GPCN-2022-003_PN change of GW1N-2K and GW1N-1P5 series products |
PCN |
GPCN-2022-003 |
|
2022/11/09 |
PDF |
|
GPCN-2022-002_GW1N-2 and GW1N-1P5 series product version upgrade |
PCN |
GPCN-2022-002 |
|
2022/11/09 |
PDF |
|
GPCN-2022-001_GW1N-LV4QN88A4 device version upgrade |
PCN |
GPCN-2022-001 |
|
2022/11/09 |
PDF |
|
GPCN-2021-007_GW1N-2 and GW1N-1P5 series product version upgrade |
PCN |
GPCN-2021-007 |
|
2022/11/09 |
PDF |
|
GPCN-2021-004_Leadframe supplier Henghui added |
PCN |
GPCN-2021-004 |
|
2022/11/09 |
PDF |