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GPDN-2024-001 GW1NZ-LV1QN48A3 Products Discontinuation |
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GPDN-2024-001 |
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12/01/2024 |
PDF |
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GOWIN 55nm FPGA SER Test Report |
Test Report |
TN708 |
1.1.2E |
15/12/2023 |
PDF |
|
GOWIN 22nm FPGA SER Test Report |
Test Report |
TN713 |
1.2E |
01/12/2023 |
PDF |
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GPCN-2023-003_A Second supplier of QFN(04040.75-0.40)032 leadframe added |
PCN |
GPCN-2023-003 |
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18/09/2023 |
PDF |
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GPCN-2023-002_GW2A-LV18EQ144 Die Thickness (After grinding) Change |
PCN |
GPCN-2023-002 |
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18/09/2023 |
PDF |
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GPCN-2021-006_GW1N(R) LV4 series product version upgrade |
PCN |
GPCN-2021-006 |
|
18/09/2023 |
PDF |
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GPCN-2021-005_GW1N(R) UV4 series product version upgrade |
PCN |
GPCN-2021-005 |
|
18/09/2023 |
PDF |
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RoHS Compliance |
Environmental Compliance |
COC-01-01 |
|
11/04/2023 |
PDF |
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GPCN-2023-001_Tray packing method change |
PCN |
GPCN-2023-001 |
|
17/02/2023 |
PDF |
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GPCN-2022-006_Change of PBGA256 package products molding compound material |
PCN |
GPCN-2022-006 |
|
21/11/2022 |
PDF |