|
Package Process Change for GW1N-LV2CS100H |
PCN |
GPCN-2026-007 |
|
2026/10/13 |
PDF |
|
Addition of Second FT Final Test Site – Shenzhen V-test |
PCN |
GPCN-2026-005 |
|
2026/10/13 |
PDF |
|
Addition of Second Source for LQFP144L(2020X1.4) Leadframe |
PCN |
GPCN-2026-002 |
|
2026/10/13 |
PDF |
|
GPCN-2026-003_GW5A-60_GW5AT-60 Series of Products Voltage Range Change |
PCN |
GPCN-2026-003 |
|
2026/06/09 |
PDF |
|
GPCN-2026-001 GW1NZ-1 Series of Products Version Upgraded.pdf |
PCN |
GPCN-2026-001 |
|
2026/05/12 |
PDF |
|
GPCN-2025-005_Second Supplier Added for 0402 1uF Capacitor |
PCN |
GPCN-2025-005 |
|
2026/01/28 |
PDF |
|
Addition of Second Source for Package Material – Polyimide (PI) |
PCN |
GPCN-2025-006 |
|
2025/12/16 |
PDF |
|
GW5ART-LV15CM90PFC1 Package Design Change |
PCN |
GPCN-2025-004 |
|
2025/07/21 |
PDF |
|
Solder Ball Change for CSP72 Package Products |
PCN |
GPCN-2025-003 |
|
2025/06/26 |
PDF |
|
Packging Method Change for VFBGA(3.8×3.8-0.5)0049 Package Products |
PCN |
GPCN-2025-002 |
|
2025/06/26 |
PDF |