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Embeddedworld
2019-02-14
GOWIN Semiconductor to Participate at Embedded World 2019 LONDON, Feb. 14, 2019 (GLOBE NEWSWIRE) -- GOWIN   Semiconductor Corp., the world’s leading innovator of programmable logic devices, will exhibit at Embedded World 2019 on February 26-28 in Nuremberg, Germany, showcasing their latest FPGA technology to the European market. They will be located in the Eldis booth, Hall 3A Stand 708.   Embedded World, held annually in Germany, is Europe’s leading trade show for all embedded solutions and technologies. With over 1000 exhibitors, it is one of the world’s largest fairs focussing exclusively on state-of-the-art embedded technologies.  This is the first time that GOWIN Semiconductor will be in attendance.   GOWIN will be featuring its leading FPGA solutions, including the GW1NS SoC product family featuring ARM Cortex M3 hardcore, the GW1NZ zero power family, the GW1N LittleBee low power non-volatile family, and the GW2A Arora high-performance family featuring PSRAM and support for RISC-V architecture suitable for ultra-low power IoT applications. There will also be a number of demos supporting these products including an SD card demo and an LVDS to MIPI high-speed video demo.   IoT and edge computing will be some of the hottest topics at Embedded World 2019.  GOWIN will discuss its latest GW1NS FPGA SoC product as it relates to these topics and the needs of the consumer, industrial, and communication markets. In the smallest package available today, the GW1NS provides the only  all-in-one and most cost-effective programmable solution for innovative IoT and edge computing applications. GOWIN and Eldis look forward to welcoming all interested customers and partners to Eldis booth in Hall 3A Stand 708.   About GOWIN Semiconductor Corporation   Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about GOWIN, please visit www.gowinsemi.com   For more information, please email Scott Casper at scott@gowinsemi.com
GW + IID 2
2019-01-24
GOWIN Semiconductor Licenses Intrinsic ID’s BroadKey to Deliver Hardware Root of Trust for IoT Security Award-winning BroadKey Accelerates Immutable and Unclonable Device Identity Solution for Programmable FPGA Chips, Including Arm and RISC-V embedded solutions   SUNNYVALE, Calif., Jan. 24, 2019 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, and Intrinsic ID, the world’s leading provider of digital authentication technology for Internet of Things security, today announced GOWIN has licensed Intrinsic ID’s BroadKey, an SRAM PUF-based key management system with integrated crypto libraries. GOWIN will utilize BroadKey to implement a secure element function in its FPGA products, including in Arm and RISC-V-based solutions. By enabling these features, GOWIN becomes the first low to mid-density FPGA company with the ability to provide system security from root of trust applications all the way to cloud channel applications.   "BroadKey allows our customers to protect their assets from being stolen or cloned during manufacturing, and provide authentication and encryption functions for edge-to-cloud applications,” said Jason Zhu, chief executive officer of GOWIN. “It was the best choice for us to establish a root of trust to protect our customers’ systems, while meeting our and our customers’ time-to-market needs. BroadKey’s more robust, foundational security can be done at a notably lower TCO, without our customers needing to integrate an additional secure element chip, or requiring special key injection on our FPGAs.”   BroadKey is a software-based approach to Intrinsic ID’s SRAM Physical Unclonable Function (PUF) hardware root-of-trust technology, and allows semiconductor and OEM manufacturers to deliver IoT security via a unique, intrinsic fingerprint identity without the need for separate security-dedicated silicon. A root key generated by BroadKey delivers a high bar of security since it is never stored and anchors to the device all other keys and security operations.   GOWIN delivers a range of FPGA solutions targeting segments including communication, industrial, automotive, medical, cloud computing and data center applications. Product families in which GOWIN will include BroadKey-based security initially are its Arora and LittleBee families. Arora products offer best-in-class performance-to-cost ratio FPGAs, optimized for co-processing to offload the Arm or RISC-V application processor on intensive computation tasks. The LittleBee products with embedded Arm processors are instant-on, non-volatile, low-power, intensive I/O and small footprint FPGAs, ideal for high-performance bridging applications. It is the first FPGA to support the MIPI I3C and MIPI D-PHY standards.   BroadKey has been recognized with two awards in recent months. It was named “IoT Security Product of the Year” in the IoT Breakthrough Awards earlier this month, and in October BroadKey received the 2018 IoT Evolution Security Excellence Award.   "GOWIN’s solutions are used for applications with challenging security needs, including smart industrial appliances, industrial controls and consumer,” said Pim Tuyls, Intrinsic ID’s chief executive officer. “BroadKey’s flexibility in creating unclonable identities for these and other IoT-connected products, without the need for additional hardware, is a great advantage for chip makers serving these markets.”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com.   About Intrinsic ID Intrinsic ID is the world’s leading digital authentication company, providing the Internet of Things with hardware-based root-of-trust security via unclonable identities for any IoT-connected device. Based on Intrinsic ID’s patented SRAM PUF technology, the company’s security solutions can be implemented in hardware or software. Intrinsic ID security, which can be deployed at any stage of a product’s lifecycle, is used to validate payment systems, secure connectivity, authenticate sensors, and protect sensitive government and military systems. Intrinsic ID technology has been deployed in more than 125 million devices. Award recognition includes the IoT Breakthrough Award, the IoT Security Excellence Award, the Frost & Sullivan Technology Leadership Award and the EU Innovation Radar Prize. Intrinsic ID security has been proven in millions of devices certified by Common Criteria, EMVCo, Visa and multiple governments. Intrinsic ID’s mission: “Authenticate Everything.” Visit Intrinsic ID online at www.Intrinsic-ID.com
未命名-2_工作區域 1
2019-01-04
Gowin Semiconductor Corp.’s Cumulative Shipments Reach 10 million pieces SAN JOSE, Calif. and GUANGZHOU, China, Jan. 02, 2019 (GLOBE NEWSWIRE) -- Gowin Semiconductor Corp. (hereinafter referred to as "Gowin"), the world’s leading innovator of programmable logic devices, announces that its cumulative shipments have reached 10 million pieces.  Among them, Gowin’s overall device sales in 2018 exceeded 8 million units, 8 times greater year over year compared to 2017.   In January 2017, Gowin shipped hundreds of FPGA devices for the first time. Since then, Gowin’s sales volume kept surging. By October 2018, the sales volume exceeded 1.2 million units per month. By the end of 2018, the annual sales volume exceeded 8 million pieces. Up to now, Gowin has more than 400 FPGA customers worldwide, including more than 150 customers in Asia Pacific (China mainland excluded), Europe, and the United States. Customer markets cover a wide range of areas including communications, industrial, medical, LED display, video, broadcast, Internet of Things, artificial intelligence and consumer electronics.    "This is a very important milestone for us," said Jason Zhu, CEO of Gowin Semiconductor Corp. "Gowin is still in the early stage of development and we are very happy to achieve such results. This fully proves that our innovative and differentiated design ideas work. We will continue to make breakthroughs in product and technology innovation, and look forward to achieving further success in 2019."   About Gowin Semiconductor Corp.: Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information, please refer to: www.gowinsemi.com   For more information, please email Scott Casper at scott@gowinsemi.com  
Gowin Europe
2018-12-11
GOWIN Semiconductor Opens European Office and Commences Sales Operations Serving the EMEA Region SAN JOSE, Calif. and GUANGZHOU, China, Dec. 10, 2018 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, announces the expansion of its global sales operations into the EMEA region. Based in the UK, the operation is managed by recently appointed Mike Furnival, Director of Sales, EMEA and General Manager of GOWIN Semiconductor (Europe). Previously, Mike Furnival held similar senior positions at XMOS Ltd. and Lattice Semiconductor UK Ltd.     “We are truly excited to be expanding our global sales activities into EMEA,” said Jason Zhu, CEO of GOWIN Semiconductor Corp. “Today, EMEA remains a very important territory for innovation, design, and quality product development, especially in the communication, industrial and automotive marketplaces. We are convinced that this expansion will significantly enhance GOWIN’s ability to demonstrate its leadership position in our fast-growing FPGA business and having Mike’s experience and knowledge onboard will ensure that our customers receive the best possible sales support activity.”   Newly appointed Mike Furnival added, “I am delighted to be joining GOWIN at such an interesting and important time in the Company’s development. I have been extremely impressed by what GOWIN has achieved thus far and am excited by the prospect of significantly contributing to its future success which I believe will be to the benefit of customers and partners alike.”   About GOWIN Semiconductor Corp.Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.   For more information about Gowin, please visit www.gowinsemi.com   Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email scott@gowinsemi.com
2018 Andes RISC-V Con
2018-11-15
GOWIN Semiconductor Promotes RISC-V FPGA Ease-of-Design Capability At Andes RISC-V Con GOWIN and Andes give away development boards to jumpstart RISC-V application efforts.   San Jose, CA, November 14, 2018 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, participated in Andes Technology's RISC-V Con held on November 13, 2018 in Santa Clara, CA. The conference was geared to introduce people to the new RISC-V microprocessor ISA as well as promote the ease of use in design environments and the supporting ecosystem.   During the event, Jim Gao, Director of Solution Development for GOWIN, gave a presentation entitled “RISC-V Microprocessor Implementation for FPGA Solutions.” And Scott Casper, Director of Sales for GOWIN, participated on a panel discussing, “Is RISC-V Ready for Your Design?” In addition, GOWIN had an exhibit demonstrating the RISC-V core operating in a Video Display system.     Jim Gao   Scott Casper    The overall conference was well received by the audience. At the conclusion, GOWIN and Andes gave each conference attendee a GOWIN GW2A18 development board with a RISC-V softcore preloaded in the FPGA to kick-off design efforts using this new microprocessor architecture.                     GOWIN's RISC-V Development Platform on GW2A Boards   For more information or questions on GOWIN’s RISC-V GW2A Development Platform, please visit our website www.gowinsemi.com or contact your local sales person.   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email scott@gowinsemi.com
Eldis 1
2018-11-15
Gowin Semiconductor Corp. Attends Electronica 2018 Gowin Semiconductor Corp. Attends Electronica 2018   Guangzhou, China, November 16, 2018 – Gowin Semiconductor Corp., the leading programmable logic devices provider in China, attended Electronica 2018 at Munich, Germany with her distributor in Europe, Eldis Technology Ltd, to demonstrate Gowin latest FPGA technology to Europe market.     Electronica is the well-known leading electronics trade show in Europe held at Munich of Germany every two years and there are more than 3600 exhibitors this year including world-wide top semiconductor companies. This is the first semiconductor event Gowin Semiconductor attended in Europe. In the event, Gowin introduces her leading FPGA solution including the latest GW1NS FPGA SoC product family and create huge awareness to the Europe market. Only the first two days of the events, there are more than 100 potential customers visited our booth and interested in Gowin LittleBee®, Arora® FPGA product family and the solutions Gowin provides to the market. The visitors are impressed by Gowin leading products and solutions including the lower power technology of LitteBee® family, high performance and cost effective Arroa® family for industrial display applications, MIPI I3C and the latest integrated pseudo SRAM for ultra low power ioT (internet-of-things) applications. They are also highly welcomed Gowin as an innovative new player in world wide FPGA industry to address the emerging technology and market needs.       Internet-of-things (IoT) and edge computing are the hottest topics in Electronica 2018 and Gowin demonstrates the latest GW1NS FPGA SoC product to address the needs of these emerging markets. With integrated ARM Cortex-M3, FPGA fabric, ADC and USB PHY in a tiny package, GW1NS provides the all-in-one and most cost effective programmable solution to the innovative IoT and edge computing applications. In the Electronica events, many IoT and edge computing products developers requested Gowin and Eldis Technology to arrange follow-up meetings to further discuss their application needs after seeing Gowin GW1NS demo in the booth.     Gowin GW1NS FPGA SOC demo     Gowin Arora 1080p MIPI demo     About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about Gowin, please visit www.gowinsemi.com       @Copyright 2018 GOWIN Semiconductor Corp. Gowin, LittleBee®, GW1N/NR®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of Gowin Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com  
GW1NZ banner 1
2018-10-29
GOWIN Semiconductor Brings Ultra Low Power Programmable Logic Devices to Market San Jose, CA and Guangzhou, China, October 29, 2018 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, introduces its latest family of small size and low power FPGA products, the GW1NZ “Mobile FPGA”. Using proprietary design techniques and the latest in ultra-low power processes, GOWIN continues to add value to mobile and wearable applications through the development of its innovative FPGA solutions.   Today, mobile and wearable applications are pushing the limits on power usage, especially where the size of devices are causing batteries to get smaller. Yet end users are wanting better battery efficiency to reduce their charging time. GOWIN addresses these concerns with the GW1NZ “Mobile FPGA.” Based on it CoolSmart® technology and TSMC’s 55nm Ultra Low Power Embedded FLASH process, GOWIN delivers an ultra-low power, small size, and cost-effective FPGA solution targeted for these mobile and wearable applications.   "Mobile and wearable device manufacturers are struggling to get the best power efficiency out of their products,” said Scott Casper, Director of Sales, Americas. “The Mobile FPGA allows these manufacturers to further stretch the power limits of their designs with a small size and cost-effective solution. We believe the GW1NZ Mobile FPGA is the first of its kind offering a cost comparable alternative to off the shelf MCU’s or ASIC’s but running faster and more efficient.”   Available in a 16-ball 1.8mm x 1.8 mm WLCSP package, the GW1NZ “Mobile FPGA” includes GOWIN’s CoolSmart® Technology, enabling a standby power below 10uW (ZV device). It will also feature MIPI I3C and MIPI SPMI master and slave hardcore IP for direct connection to other MIPI compliant devices. The first offering will be a 1K LUT device; more sizes and package options are forthcoming.   Device programming is accomplished with GOWIN’s proprietary toolchain. In addition, a complete library of IP cores and reference designs are available to assist in developing platform solutions. All of these resources are available for download on GOWIN’s website, www.gowinsemi.com. The GW1NZ-LV1 (1.2V core VCC) device is in production today.   The GW1N-ZV1 (0.9V core VCC) samples will be available in early 2019. Please contact your local sales person or distributor for further details.   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email scott@gowinsemi.com
MIPI DevCon 2018
2018-10-21
Gowin Semiconductor Corp. Attends MIP DEVCON, SEOUL 2018 Guangzhou, China, October 21, 2018 – Gowin Semiconductor Corp., the leading programmable logic devices provider in China, attended MIPI DevCon Seoul 2018 on 19 October 2018 at Millennium Seoul Hilton and demonstrated Gowin industry leading I3C solution based on Gowin LittleBee® family GW1N9 devices.   MIPI DevCon is the annual conference organized by MIPI Alliance and tailored to developers who are interfacing sensors in mobile, IoT or automotive designs, or integrating and testing imaging, displays and touch components in connected cameras, tablets, laptops and other devices. MIPI DevCon Seoul brings the latest information on MIPI specifications to developers in the region.   As member of MIPI Alliance, Gowin Semiconductor is invited to demonstrate her industry leading I3C solution in the event. The I3C demo is based on Gowin low power, non-volatile LittleBee™ family GW1N-9 device and GOWIN I3C-ECO-IP package to provide I3C Master and I3C Slave solution. GW1N-9 is the first product in the FPGA industry supported MIPI I3C and MIPI D-PHY GPIO standard; and GOWIN I3C-ECO-IP package is fully compliant with MIPI Alliance’s I3C standard. The current version of GOWIN I3C-ECO-IP package supports SDR-Mode (Single-Data-Rate) and will support DDR-Mode (Double-Data-Rate) with full features set including I3C-Master-Salve-Combined, I2C-Master-Salve-Combined, I3C2SPI-bridge, I3C2UART-bridge, SPI-Master-Salve-Combined, and UART-Host-Device-Combined in its upcoming versions.     “We are excited to be invited to demonstrate our industry leading I3C solution in the MIPI DevCon Seoul,” said by Stanley Tse, Regional Sales Director of Gowin Semiconductor Corp., “Gowin Semiconductor is the first FPGA supplier in the industry to provide MIPI leading I3C solution to market and we have tremendous success since we launched our solution this January. We provide the most cost effective, low power, programmable and easy to use I3C solution in silicon to enable customers to validate their I3C slave chipsets with Gowin  GW1N-9 devices and GOWIN I3C-ECO-IP package . Customers around the world including United States, China, Europe, Korea, Taiwan, South East Asia are using Gowin I3C solution to accelerate their products launched to market. In this MIPI DevCon, we are excited to see that I3C is being the emerging standard in mobile, wearable and iOT application and extending to automotive and other market segment driven by MIPI Alliance; and we, Gowin Semiconductor, is honor to accelerate the market adoption of I3C with our leading FPGA products and solution.”   About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about Gowin, please visit www.gowinsemi.com       @Copyright 2018 GOWIN Semiconductor Corp. Gowin, LittleBee®, GW1N/NR®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of Gowin Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com
Arm_TechCon_2018_Design_Innovation_of_the_Year_Finalist_1600x900
2018-10-10
GOWIN Semiconductor’s GW1NS Family of Products Named Arm TechCon 2018 Innovation Award Finalist for Design Innovation of the Year GUANGZHOU, China and SAN JOSE, Calif., Oct. 10, 2018 – GOWIN Semiconductor today announced that its GW1NS product family was named a 2018 Arm TechCon Innovation Award finalist for design innovation of the year.   GOWIN's GW1NS-2C is the first of its microprocessor-based SoC family. The architecture of the product is unique in that it uses a shared resource technology. Typically, a microprocessor is designed with the core of the processor connected to peripherals via a bus architecture. The peripherals could include JTAG, SRAM memory, I/O interfaces, PLL's, oscillators, etc The GW1NS-2C shares its peripheral resources with a barebone Arm Cortex M3 to leverage the complete system for size and power. In addition, because the peripheral functionality is located inside the FPGA portion of the SoC, it is possible to change the peripheral functionality by reprogramming the FPGA fabric. This allows for complete flexibility in a SoC environment that no other microprocessor product can offer today.   The Arm TechCon Innovation Awards program celebrates leading-edge Arm-based technologies that have spawned new applications and sparked innovation in systems design. Arm TechCon, the world's leading conference and exhibition showcasing Arm-based technologies, will be held Oct. 16-18 at the San Jose Convention Center.   A tour of finalists' booths and their technologies will be conducted at Arm TechCon Wednesday Oct. 17 at 3:30 p.m. Winners will then be announced at 5 p.m. in the expo theater. For more information and to register for the event, please visit armtechcon.com.   "We are honored to receive this recognition from Arm. As a partner, they have been very supportive of our approach to innovation,” said Scott Casper, Director of Sales, GOWIN Semiconductor. “The GW1NS family demonstrates incredible functionality and flexibility needed for the success of today’s system designs. We are happy to be accelerating growth in this field.”   About GOWIN Semiconductor Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   About Arm Arm technology is at the heart of a computing and connectivity revolution that is transforming the way people live and businesses operate. Our advanced, energy-efficient processor designs have enabled the intelligent computing in more than 125 billion chips. This technology combined with our IoT software and device management platform enable customers to derive real business value from their connected devices.   @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email scott@gowinsemi.com