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Gowin_FMA
2018-05-21
GOWIN Semiconductor Accelerates Growth with Opening of New North America Sales Office in Silicon Valley     The new office location enables GOWIN Semiconductor to accelerate marketing and sales growth in the Americas Region   SAN JOSE, CA  May 17, 2018 – GOWIN Semiconductor Corp., a leading provider of low power, small package, and performance driven Field Programmable Gate Arrays (FPGA), recently opened a sales office in Silicon Valley to accommodate the rapid growth of programmable logic devices used in consumer, communications, industrial, automotive, and medical marketplaces throughout the Americas Region.       In addition to the new office in Silicon Valley, GOWIN Semiconductor has signed on Fahrner-Miller Associates, an electronics manufacturers representative, to market and sell the complete line of FPGA products in Northern California and Northern Nevada.  This assignment helps to fast-track GOWIN’s presence and penetration into one of the worlds leading technical regions for development.   “The decision to expand our presence into North America has been on our roadmap for a long time as part of our business growth strategy, to complement our business success in Europe and Asia,” said Jason Zhu, CEO of GOWIN Semiconductor Corp.  “The Silicon Valley area is rich with opportunities today that can take advantage of GOWIN’s product value.  As we grow further in the region, we will leverage the vast talent pool located here and elsewhere to aid in our expansion.”   “I am honored and excited to lead the marketing and sales team enabling growth,” said Scott Casper, Director of Sales, Americas.  “Silicon Valley is an important area for us to start our expansion plans into the North America target markets. With our products, we look forward to participating in the technology advancements here.”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in USA and China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com
GOWIN Eldis
2018-03-27
GOWIN Semiconductor Corp. Appoints Eldis Technology as Distributor in Israel Guangzhou, China, March 27, 2018 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces appointing Eldis Technology Ltd as distributor in Israel. The appointment represents that Gowin further expands her products offering to Europe, after establishing sales network in Asia   “We are excited to appoint Eldis Technology as our distributor in Israel. Eldis Technology has strong technical expertise and customer bases in telecommunication, computing storage, security and medical segments such as ECI, Checkpoint and many others leading manufacturers world-wide,” said by Stanley Tse, Regional Sales Director of Gowin Semiconductor Corp. “The partnership with Eldis Technology will accelerate Gowin products design wins into global market leaders after our tremendous success in Asia. Besides our strong shipment in China, we have built up outstanding design pipeline in Korea and Taiwan after we have setup distributors there in less than 6 months. Now we are expecting these track record happened in Israel and Europe again with Eldis together.  And most importantly, Gowin shares the same business philosophy with Eldis - we pride ourselves on our ability to meet and exceed our customers’ diverse expectations”   “We are very pleased and excited to have Gowin line added to our portfolio,” said Dov Armon , C.E.O of Eldis Technologies . “There is a clear synergy between our current line card and Gowin, We quite often see FPGA employed in our designs on the same board. I am confident that our customers will benefit of Gowin technology combined with Eldis support in terms of enjoying Gowin quality and shorten Time-To-Market. The Israel fast-growing market and the many start-ups continuously looking for new and exciting solutions. It is also of our team’s intention to use our position as a leading distributor to open the door for Gowin to penetrate into more European territories”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   About Eldis Technologies Ltd. Founded in 1991, headquartered in Herzeliya, Eldis Technologies is a leading sales, marketing and technical consulting organization specializing in high-performance microchips and related products for the Israeli Telecommunications, Defense and Medical industry. Eldis Technologies is the Israeli technical representatives and distributor of some of the leading international manufacturers of Semiconductors and components for Telecom, Datacom, networking and System on Chip based systems. Eldis offers a global service, from technical support and field application engineering through logistics and contracts. As specialized sales representatives of sophisticated integrated circuit based products, Eldis applies strategic sales and marketing models geared specifically to the Israeli market and to the advanced nature of its product line. Eldis also operates a New York based subsidiary operates as its logistics hub. For more information about ELDIS, please visit www.eldis.co.il     @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com  
HK Office
2018-03-12
GOWIN Semiconductor Corp. Announces Opening New Technology Center in Hong Kong Science and Technology Parks of Hong Kong GOWIN Semiconductor Corp. Announces Opening New Technology Center in Hong Kong Science and Technology Parks of Hong Kong       Hong Kong, China March 12th, 2018 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces opening new technology center in Hong Kong. The new technology center is located in Lakeside 2, Phase 2 of Hong Kong Science and Technology Parks and it will be the fifth R&D centers of Gowin Semiconductor after Jinan, Shanghai, Guangzhou of China and San Jose of US.   “We are excited to open our fifth technology center in Hong Kong Science Parks and the center will play an indispensable role to support our international customers and partners on innovative technology development with Gowin products and solutions” said by Jason Zhu, CEO of Gowin Semiconductor Corp. “As a technology driven company, Gowin will develop a high quality engineering team in Hong Kong. We choose the location in HKSTP as we believe that the living environment in Hong Kong can attract high quality engineers to work in here. And as a China based leading FPGA company, Gowin also has social responsibility to cultivate the Hong Kong graduates to be semiconductor professionals, aligning with the National developm,ent strategy on semiconductor industry of China.”   “As a grown-up in Hong Kong, I am very honor to lead and develop the technology center in Hong Kong,” continued by Stanley Tse, General Manager of Hong Kong Gowin Semiconductor, “Developing tech high industry in Hong Kong is one of the most important strategies in the latest Chief Executive Policy Address of HKSAR; and Gowin selects Hong Kong to be our fifth technology center emphasizing our support to the high tech strategy of HKSAR.  The location of HKSTP can bridge us not only with Hong Kong local technology industry and institutions; but also with our international customers and technology partners; this is essential to Gowin as we are developing world wide FPGA ecosystem in fast paces. In fact, we are already working on an emerging application with a Hong Kong based leading semiconductor company, also with their R&D center in HKSTP. This application is based on our newly released I3C IP as Gowin Semiconductor is the only FPGA supplier in the semiconductor industry who can provide I3C master and slaves IP on silicon devices to customers. With our technology center opened in HKSTP, we are expecting rapid growing on such emerging technology cooperation with the industry.”           About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com       @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com  
I3C Block Diagram
2018-01-09
GOWIN Semiconductor Corp. Announces MIPI I3C Standardized Sensor Interface Solution JiNan, China, Jan 10th, 2018 – GOWIN Semiconductor Corp., the World’s leading non-volatile-technology programmable logic device provider, today announces SDR-Mode (Single-Data-Rate) MIPI I3C Standardized Sensor Interface Solution – A High-Speed Serial Interface IP (Master-Slave-Combined). The solution is based on GOWIN LittleBeeÒ family GW1N-9 device, including IP core, reference design and development board as a total solution.               I3C is a new generation two-wire serial bus interface developed by MIPI Alliance Sensor Working Group and collaborated by industry-wide sensor chip makers, IP companies and Top-Tier ODMs in mobile and embedded markets. I3C is targeted to be a fundamental interface for mobile, embedded system and IoT applications; it is an extension of former I2C standard and downward compatible. GOWIN Semiconductor Corp, a member of MIPI Alliance, offers the GWI3C IP solution, which is fully compliant with MIPI Alliance’s I3C standard. The IP can be dynamically configured to be I3C Master or I3C Slave, implemented within GW1N family FPGA, for communicating seamlessly with any other devices compliant with MIPI Alliance SWG I3C and I2C standard.               “As the first China-based MIPI Alliance member and leading FPGA supplier, GOWIN Semiconductor Corp. is committed to deliver the latest technology to our customer,” Stanley Tse, Regional Sales Director (Asia) of GOWIN Semiconductor Corp. “The GWI3C IP that GOWIN announces today supports SDR-Mode (Single-Data-Rate) and we will support DDR-Mode (Double-Data-Rate) to achieve much higher transfer data rate up to 33Mbps in future release. The current release is downward-compatible with I2C protocol and able to connect I2C slave devices directly, while we will extend to support I3C-To-SPI and I3C-To-UART bridging in next release. The GOWIN I3C-ECO-IP package will contain full features set including I3C-Master-Salve-Combined, I2C-Master-Salve-Combined, I3C2SPI-bridge, I3C2UART-bridge, SPI-Master-Salve-Combined, and UART-Host-Device-Combined in its upcoming versions. Therefore, our customer can implement the I3C Master function within GW1N FPGA family device to communicate with other SPI-Slave and UART devices in the same system directly. This enables customer to adopt the latest high-speed, low-power I3C technology immediately to enhance their products performance, while still able to connect with low cost and legacy SPI/UART sensors or other I2C slave devices in the same system. Thus, fulfills GOWIN’s commitment to the industry: accelerate customer innovation with competitive cost.”             Dr. Song, Ning, CTO & President of GOWIN Semiconductor Corp. continued to comment, “Our GWI3C IP implemented on GOWIN LittleBeeÒ family FPGA has the advantages of utilizing low pin count on and enhances features-to-cost ratio. It significantly reduces the number of physical ports connecting to devices in today’s electrical system. In addition, the GWI3C system has features of higher data transfer rate, backward compatible with existing bus protocols, while still able to keep the whole system at low power. All these meet the exact key design criteria in today mobile devices, ADAS and IoT applications.”   I3C Typical Application Motion sensing (gyro, accelerometer) Environment perceptional sensing (sounds, light, temperature, humidity) Bionics sensing (fingerprint, heart rate monitoring, respiratory frequency) Communication (NFC, IrDA)   GWI3C Basic Features Feasible and programmable: support adjustable data and clock duty cycle in high precision, to achieve wide range data transmission rate, Support static addressing Support dynamic addressing Support I3C address arbitration Single Data Rate (SDR)   GWI3C Advanced Features Support hot-socket Support dynamic addressing in hot-socket Supports Slave requests Secondary Master (SDR-only) Support In-band Interrupts Support Common Command Code (CCC)   GW13C Transmission Rate             GOWIN YunYuanÒ EDA fully automates the GWI3C IP (Master-Slave-Combined) design integration with user application. GWI3C IP (SDR-mode) supports data rate up to 12.5Mbps.    GW1N-9 FPGA             GW1N-9 IO block integrates a new enhanced configuration IO circuitry which is designed to meet MIPI I3C specification; and these enhanced IO circuitry is on two banks of GW1N-9 IO blocks. Users do not need to make any change on software when using such enhanced IO circuitry. The only thing need to do is to enable I3C mode in the PNR constraints for GOWIN YunYuanÒ EDA.   GWI3C IP Development Board and Reference Design On top of GWI3C IP, GOWIN provides full function I3C development board for customer to develop I3C application off the shelf. Moreover, the I3C development board is designed to be stackable and can be used to communicate with multiple devices at the same I3C bus.         About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world-wide with programmable solutions. We focus on optimizing our products and removing barriers for customers in using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   @Copyright 2017 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN YunYuan and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com
车用级芯片-B-2
2017-11-30
GOWIN Semiconductor Corp. Announces Automotive Grade Devices Targeting to Automotive Market Guangdong, China Nov 30th, 2017 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces automotive temperature grade devices of the non-volatile LittleBee®  product family. GOWIN LittleBeeÒ FPGA family is based on 55nm embedded flash non-volatile technology, which has been offering industrial temperature range (-40°C ~ +100°C) devices to the market since it was launched in 2016; and now extend the offering to automotive temperature grade (-40°C ~ +125°C) for selected devices of the family. GOWIN LittleBee® non-volatile FPGA family has incomparable features including low power, high IO counts, abundant logic resources, high speed LVDS and supports random access mode of user flash; all these features enable LittleBee® family quickly adopt by customers in industrial and consumer market since it was launched in 2016. Besides, GOWIN LittleBee® family is the first FPGA in the industry to support the leading I3C standard from MIPI Alliance Sensor Working Group and able to use its GPIO to implement MIPI D-PHY standard. The latest I3C specification supports Push-Pull SDR (Single-Data-Rate), HDR-DDR mode (High-Data-Rate Double-Data-Rate) and the highest data rate can achieve 12.5Mbps. The GPIO of GOWIN LittleBee® GW1N devices integrates circuitry to support MIPI HS/LP mode switching, which removes the external matching resistors, significantly reduces the PCB design complexity and increase system reliability.   “The introduction of automotive temperature range devices to market today is just the first step to show GOWIN’s commitment on automotive market,” said by Mr. Zhaolin Wu, Director of Operation and Manufacturing, GOWIN Semiconductor Corp. “We have also kicked-off the complete automotive grade product supply chain qualification process including AEC-Q100, Zero Defect and ISO/TS16949 certification. As all the GOWIN’s manufacturing partners already have these certification, we are confident to offer the market our automotive grade devices in very near future.” “Automotive market is one of the focus and fast growing segments in semiconductor industry. The CAGR of semiconductor revenue in this market is over 10% world wide and up to 20% in Asia,” Mr. Stanley Tse, Regional Sales Director (Asia) of GOWIN Semiconductor Corp., continues to comment, “however, there are only a few semiconductor suppliers are willing and able to commit to this market as it requires long term and high investment on the product development and whole supply chain. GOWIN Semiconductor Corp., as the leading China based FPGA supplier, we are confident and commit to the automotive market. We see that FPGA is moving from peripheral to core component in automotive applications while ADAS, high end In-vehicle Infotainment, functional safety and electronic vehicles are getting popular in the market. All these applications require programmability and parallel processing, which is the sweet-pot of FPGA. We are highly confident that our Return-On-Investment will be fully justified by the emerging FPGA opportunities in the automotive market.”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com       @Copyright 2017 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com  
2017-10-25
Introduction Video of Gowin Semiconductor Corporation 2017 Shanghai Conference
Oct 17 Conference
2017-11-02
Short Video of Gowin Semiconductor 2017 Shanghai Conference in 2 minutes
Oct 17 Conference
2017-10-26
GOWIN Semiconductor Corp. Announces GW1NS New SoC FPGA Product Family at GOWIN 2017 New Products Conference in Shanghai Shanghai, China Oct 26th, 2017 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces GW1NS new product family at GOWIN “Programming the Future”- 2017 New Products Launch Conference in Shanghai, China. GW1NS family is the first SoC FPGA embedded ARM Cortex-M3 32bits microprocessor from GOWIN Semiconductor and the FPGA fabric is based on GOWIN LittleBeeTM low power technology. The GW1NS family also integrates MIPI D-PHY, USB PHY and up to 12bits ADC to provide the highest integration of application specific programmable logic solution.   “Embedded processor is the megatrends of FPGA industry and GOWIN always listens and responses to customers requirement,” said by Jason Zhu, CEO of GOWIN Semiconductor Corp. “We select ARM Cortex-M3 to be the embedded processor for our first SoC FPGA GW1NS family as its proven success in the ioT market and perfect matches with our LittleBeeTM low power technology required by this application. The embedded processor market size of ioT market is expected to be over $30bn by 2020 and we are confident to gain market share quickly by integrating these two proven success technologies, ARM Cortex-M3 and GOWIN LittleBee”, to provide our customers the most cost effective and easy-to-use solution to accelerate their innovation.”   GW1NS SoC FPGA family product samples will be available in December 2017. Besides GW1NS family, GOWIN Semiconductor Corp. also announces the first 28nm GW3AT-100 Arora family FPGA and shares our milestones with the guests in the “Programming the Future” conference, Successfully launched two product families, ArroaTM and LittleBeeTM, to the FPGA industry, offering 4 products series, GW2A, GW2AR, GW1N, GW1NR, with 11 part numbers and more than 50 package options to customers, since the Corporate founded in 2014. AroraTM family, GW2A-55 as the first 4M gates commercial available FPGA from China FPGA suppliers. AroraTM family, GW2AR-18, the innovative FPGA with embedded DDR/SDRAM in the industry and widely adopted by China customers in outdoor LED display market. LittleBeeTM, the industry low power FPGA based on 55nm LP technology, achieves tremendous success in the non-volatile FPGA markets, 200+ customers and with 20+ in mass productions. Forecast to ship over 1M units by 2017. Proprietary GOWIN YunYuanTM EDA is upgraded to latest version 1.79 with SimplyproTM official license from SynopsysTM for front-end synthesis; Increasing number of off-the-shelf proprietary IP to reduce customer design cycle, which includes high-speed DDR interface, MIPI, LVDS gearbox and more Proactively participates and contributes to international industry alliance including MIPI Alliance, RISC-V Foundation but not limited to. Extend sales network and distribution partners in Korea and Taiwan   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   @Copyright 2017 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com
IMG_3464
2017-10-19
GOWIN Semiconductor Corp. Announces to Join RISC-V Foundation Membership Foshan, China Oct 19th, 2017 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces to join RISC-V Foundation membership as the first China based FPGA manufacturer in the membership. This is also the second international industry alliance that GOWIN participates after MIPI alliance in 2016, a clear commitment to the industry on our vision to be an international FPGA supplier.     RISC-V (pronounced “risk-five”) is a new instruction set architecture (ISA) that was originally designed to support computer architecture research and education; and is now set to become a standard open architecture for industry implementations under the governance of the RISC-V Foundation. RISC-V ISA is designed from ground-up to be scalable to wide range of applications from high performance computing servers to low power embedded systems and IoT devices. Moreover, RISC-V ISA is open sources and freely available for anyone to design, manufacture chips based on the RISC-V ISA. The RISC-V ISA was originally developed in the Computer Science Division of the EECS Department at the University of California, Berkeley.   “As the first China based FPGA manufacturer to be the member of RISC-V Foundation, GOWIN’s mission is to contribute to the affiliation by developing the RISC-V ecosystem and disseminating the RISC-V ISA to customers in China and Asia”, said by Dr. Ning Song, President and CTO of GOWIN Semiconductor Corp. “We are implementing RISC–V ISA in our AroraTM family devices to enable customers accelerate their innovation through the free, simplified RISC-V ISA and our high performance, cost effective FPGA. This product strategy is especially important in China and Asia countries as the governments, the market here are encouraging startups and innovation. GOWIN is confident to achieve our mission as we have the best FPGA products, R&D and application team in China to support our customers and ecosystem here.”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   About RISC-V Foundation RISC-V (pronounced “risk-five”) is a new instruction set architecture (ISA) that was originally designed to support computer architecture research and education and is now set to become a standard open architecture for industry implementations under the governance of the RISC-V Foundation. The RISC-V ISA was originally developed in the Computer Science Division of the EECS Department at the University of California, Berkeley.   The RISC-V Foundation, a non-profit corporation controlled by its members, directs the future development and drives the adoption of the RISC-V ISA. Members of the RISC-V Foundation have access to and participate in the development of the RISC-V ISA specifications and related HW / SW ecosystem. For more information about RISC-V Foundation, please visit https://riscv.org   @Copyright 2017 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com