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Low power
2018-09-11
GOWIN Semiconductor Unveils the Latest Embedded Memory Products for Their Families of Programmable Logic Devices Guangzhou, China, September 17, 2018 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, announces 2 new additions to the current families of embedded memory FPGA devices, the GW1NR-LV4MG81 and GW1NSR-LX2CQN48.  As computing functions are being distributed to edge locations, the need for silicon to adapt to these new uses is becoming prevalent.  The 2 new embedded FPGA devices were designed with low power, small package size, and low cost in mind.    Adopting an edge to cloud infrastructure is challenging.  Each portion of the chain has its own unique characteristics in design.  For the edge, size of sensor or data gatherer affects product real estate; power consumption affects the power source, especially battery life.  The new embedded memory FPGA devices solve these issues by enhancing the integration of multiple devices into a nice, single package device.   “GOWIN’s vision has always been one of developing new products for customer’s needs,” said Jason Zhu, CEO of GOWIN Semiconductor.  “We saw a lack of product integration at the edge and aimed to fix this with easy to use solutions at cost-effective price points.”   The GW1NR-LV4MG81 is a 4K LUT FPGA fabric with 64Mb internal high-speed memory.  The package size is ultra-small, 4.5mm x 4.5 mm PBGA and .83mm thick.  A great logic device for applications where the thickness is an issue.   Power consumption has been optimized to the lowest possible using TSMC’s 55nm LP process.  And up to 69 user IO’s are available supporting GOWIN’s flexible IO structures.   In a 5mm x 5mm QFN package, the GW1NSR-LX2CQN48 is GOWIN’s first device that combines a 2K LUT FPGA fabric with 32Mb internal high-speed memory and an Arm Cortex M3 microprocessor.  With additional user programmable flash, internal SRAM, ADC, and both USB2.0 and MIPI D-PHY interfaces, this makes the GW1NSR-LX2CQN48 a true SoC to solve low power requirements at the edge and elsewhere.    GOWIN offers a complete all-in-one toolchain for both FPGA fabric programming and Cortex M3 programming.  In addition, a complete library of IP cores and reference designs are available to assist in developing platform solutions.  All of these resources are available for download on GOWIN’s website, www.gowinsemi.com.   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com     @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email scott@gowinsemi.com  
US edge
2018-08-27
GOWIN Semiconductor Corp. Announces RISC-V Microprocessor Implementation for GOWIN FPGA Solutions and Expands Sales Channels in the Americas Region GuangZhou, China, Aug. 27, 2018 – GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, announces their development of RISC-V Microprocessor IP implemented in their current ARORAÒ Family GW-2A FPGA products.  In addition, GOWIN launches an Industry Early Adopter Program to kickstart engineering design activity.  The Industry EAP includes: an FPGA programming bit-file reference design with RISC-V Microprocessor core, AHB & APB Bus, Memory Control & Peripherals, as well as the GW-2A development board for a complete, ready to use solution.   RISC-V is a free and open ISA enabling a new era of processor innovation through open standard collaboration. The RISC-V ISA has been designed with small, fast, and low-power real-world implementations in mind without over-architecting for a particular microarchitecture style. The instruction set also has a substantial body of supporting software for a comprehensive design ecosystem.   “GOWIN’s FPGA solutions showcase the growing adoption of RISC-V around the world. It’s exciting to see how the RISC-V ecosystem is maturing as more companies design innovative implementations based on the free and open ISA,” said Rick O’Connor, executive director of the non-profit RISC-V Foundation.   The GOWIN Arora® Family GW-2A FPGAs offer best-in-class performance at an effective cost. With abundant logic, high performance DSP resources, and high speed I/O, the family is optimized for co-processing of computation tasks while hosting the RISC-V Microprocessor soft core. The Arora® family is also the first FPGA with embedded DRAM in the industry, allowing customers to design without using up I/O for external memory.   GOWIN also announces today the appointment of Edge Electronics as their US National Distributor and EBBM, Inc as their East Coast Manufacturers Representative.  “Demand is high for our innovative FPGA products serving the low to mid density logic element markets,” said Scott Casper, Director of Sales for GOWIN’s Americas Region, “The need for the right channel partners is necessary for our growth.  We are excited to be working with Edge and EBBM as we continue our Americas expansion plan.”       “GOWIN Semiconductor is a natural fit alongside our semiconductor and LCD solutions product offerings, both of which are geared toward serving North American industrial, medical and automotive OEM markets among others,” says Michael Pollina, Edge Electronics’ VP Operations & Procurement. “GOWIN’s collection of development tools in tandem with Edge’s engineering team will make it simple for customers to transition existing designs or start new projects with low power, space-efficient and cost-effective FPGA solutions.”   "We are thrilled to be working with GOWIN, one of the Silicon60 Most Remarkable Global Technology Startups," said Chief Executive Officer of EBBM, Inc., Alex Angelou. "EBBM, Inc has been helping custom logic architects quickly articulate their design and beat their competition to market for 14 years. GOWIN’s One-Stop Complete Solution, including DVK, EDA, IP, is a perfect match to bring the competitive advantage to more companies," said EBBM, Inc. Chief Strategy Officer Ken Cheo.   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   About Edge Electronics: Edge Electronics, Inc., based in Bohemia, N.Y., is a leading authorized distributor of electronic components (semiconductors, passives, and interconnect), display solutions (LCDs and related products), embedded computing and storage products. With strategically located sales offices throughout the U.S., Edge focuses on providing industrial, medical, military and commercial OEMs and contract manufacturers with the most personalized customer service in the industry, easy access to the latest technologies, and fully customizable solutions that are the perfect fit for each customer's specific application and business model. Founded in 1990, Edge Electronics is a certified Women's Business Enterprise (WBE) that is both established and flexible, making it an invaluable supply-chain partner for any organization. For additional information about Edge Electronics, Inc., please visit www.edgeelectronics.com. About EBBM Inc. EBBM, Inc. was established in 2004 as a Field Application Engineering and Sales firm for Disruptive CPLD, FPGA, ASIC, and SoC custom logic manufacturers. Products include all logic densities from small to very high . For more information about EBBM, Inc., please visit www.ebbmsemi.com.     @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email scott@gowinsemi.com  
Gowin_Alcom
2018-08-20
Gowin announces RISC-V implementation of Arora® FPGA and an Alcom Electronics distribution tie-up in Europe Guangzhou, China, August 20, 2018 – Gowin Semiconductor Corp., the leading programmable logic devices provider in China, today announces Industry Earlier Adopter Program of RISC-V microprocessor implementation of Gowin ARORA® Family, including FPGA programming bit-file of a system level reference design with RISC-V MCU core, AHB & APB Bus, Memory Control & Peripherals, as well as GW-2A development board as total solution.               RISC-V is an open specification of an Instruction Set Architecture (ISA). The RISC-V ISA has been designed with small, fast, and low-power real-world implementations in mind, but without over-architecting for a particular microarchitecture style. Gowin Arora® Family GW-2A FPGA are designed to offer the best-in-class performance cost ratio FPGA. With abundant logic, high performance DSP resources, and high speed I/O, the family is optimized for co-processing to offload the application processor on intensive computation tasks, as well as neatly optimized as the direct host of embedded microprocessor, like RISC-V ISA MCU soft core. The Arora® family is also the first FPGA with embedded SRAM in the industry, which gives customers more useable I/O. Gowin Industry Earlier Adopter Program of RISC-V Microprocessor offers a total solution including, GW-2A FPGA Device Chip GW-2A FPGA Development Board Hardware, with Micro-USB Download/Debug Cable GW-2A FPGA programming bit-file of a system level reference design with RISC-V MCU core, AHB & APB Bus, Memory Control & Peripherals Gowin FPGA Design EDA Software Suite, including Gowin IP-Core-Generator, supplying a rich set of Verilog Design IPs of Memory Controller, Datapath, DSP, etc., for building customized peripherals and/or interfacing module to the RISC-V MCU System Software Tool Chain (C-Code Compiler, Linker, Debugger) as well as RSIC-V MCU peripheral Software drivers, and built-in libraries for customized C-Code development   At the same time, Gowin also announces appointing Alcom Electronics as distributor in Benelux covering Europe. The appointment represents that Gowin further strengthens her distribution network and support to customers in Europe.   “We are excited to appoint Alcom Electronics as our distributor in Benelux covering Europe markets. With more than 50 expertise focusing on providing customers one-stop service from design concept to reliable logistics, Gowin will further strengthen our high quality support to customers in Europe,” said by Stanley Tse, Regional Sales Director of Gowin Semiconductor Corp. “In less than one year, Gowin has completed our distribution and support network over the world and we are the only China based FPGA company can offer our products internationally. This is a significant recognition on our products innovation and quality of services from the industry. With our first FPGA SoC GW1NS-2 launches and Gowin Industry EAP of RISC-V to the market, Gowin expands our severable markets from programmable logics to the huge microprocessor market, the partnership with Alcom is important to our serve our customers in Europe as Alcom has good customer coverage and strong technical team on embedded system.”   “Alcom electronics has a proven track record as a Specialist Distributor in bringing new innovations and technologies to the Electronic components and Module markets.  Programmable Logic Solutions have always been a key corner stone in Alcom’s business historical success”, said by Luc Spiessens, Managing Director of Alcom Electronics for Belgium/Luxembourg, “Therefore, we are proud to sign up with Gowin as a new challenger providing innovative programmable solutions with the aim to win market share from well-known competitors.  A strong price/performance ratio and integration level in combination to the lowest power consumption are some of the key differentiators in the offering.  As a strong team, Alcom and Gowin will jointly work together to support customers starting at the design phase.  Alcom invested into training programs for its Sales & Application resulting into the appointment of Gowin Certified FAE’s allowing the fastest time-to-market.  The team can be contacted at Alcom via www.alcom.be for Belgium and Luxembourg and www.alcom.nl for the Netherlands.” About GOWIN Semiconductor Corp. Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about Gowin, please visit www.gowinsemi.com   About Alcom Electronics Alcom electronics is the leading “technical distributor/stocking rep and manufacturers’ representative” for Electronic Components, Wireless Modules, Embedded Computing & Communications Technology, Optoelectronics and Power Solutions in the Benelux. Since its inception in 1980 we sell high quality system components and integrated solutions with all round services. Alcom has been the trend-setter providing complex and/ or customer specific solutions to approximately 1500 customers by Specialism, Knowledge and Expertise starting at the design concept. We bring leading edge innovations with a competent and dedicated team of 50 people to the market servicing a wide variety of customers either OEM, big, small or start-ups active in diverse vertical market segments and applications securing our growth For more information about Alcom, please visit www.alcom.be for Belgium and Luxembourg and www.alcom.nl for the Netherlands.   About RISC-V Foundation RISC-V (pronounced “risk-five”) is a new instruction set architecture (ISA) that was originally designed to support computer architecture research and education and is now set to become a standard open architecture for industry implementations under the governance of the RISC-V Foundation. The RISC-V ISA was originally developed in the Computer Science Division of the EECS Department at the University of California, Berkeley. The RISC-V Foundation, a non-profit corporation controlled by its members, directs the future development and drives the adoption of the RISC-V ISA. Members of the RISC-V Foundation have access to and participate in the development of the RISC-V ISA specifications and related HW / SW ecosystem. For more information about RISC-V Foundation, please visit https://riscv.org     @Copyright 2018 GOWIN Semiconductor Corp. Gowin, LittleBee®, GW1N/NR®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of Gowin Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com
GW1NS-small
2018-07-24
GOWIN Semiconductor Corp. Announces LittleBee™ Family GW1NS Series GW1NS-2K FPGA SoC Device Engineering Samples and Development Board Available Guangzhou, CHINA, July 23rd 2018 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces Gowin first FPGA SoC devices LittleBee™ family GW1NS series, GW1NS-2, engineering samples and development board available now. The availability of GW1NS is the prologue of Gowin strategy on artificial intelligence (AI) and the emerging edge computing market.     GW1NS-2 FPGA SoC device inherits the innovation of LittleBee™ family with embedded ARM Cortex-M3 hardcore processor and integrated USB2.0 PHY, user flash, SRAM read/write controller and ADC convertor, providing customers all-in-one embedded solution with programable logic features in one chip. With Gowin integrated development environment, engineers can develop their hardware and software in a single platform, which is another innovation of FPGA design platform and reduces engineering design cycle.   As the first Gowin FPGA SoC device, GW1NS-2 adopts ARM Cortex-M3 as embedded hardcore processor to utilize system control function with minimum internal memory. The integrated flexible and high performance FPGA logic elements provide high computational power for engineers to implement various efficiency control peripherals and exceptional system interrupts. As a member of LittleBee™ family, GW1NS-2 provides customers all leading features of the family like high performance logic, low power consumption, high IO to logic ratio, instant-on, non-volatile, high security, abundant package option, high design flexibility and low cost features.   GW1NS-2 FPGA SoC devices offer seamless connection between programmable logic devices and embedded processor, compatible with wide range of peripheral devices standard and reduce system cost significantly. GW1NS-2 is designed for various applications of industrial control, communication infrastructure, Internet-of-things, servo control, smart home, security encryption and consumer electronics.   As shown in Figure1, the application development of GW1NS-2 FPGA SoC integrates hardware and software design flow, i.e., FPGA hardware logic design flow and embedded processor software design flow. The primary objective of FPGA SoC design is to configure the FPGA logic elements to be various physical peripherals of the embedded processor (CPU). After completing the architecture and hardware design with the FPGA logic, engineers can do embedded processor software programming to configure these peripherals. Gowin provides GW1NS-2 FPGA SoC devices and driver library, combining the software design tools (Compiler, Linker, Debugger) in an integrated development environment to support GW1N2-S FPGA SoC embedded processing programming; and also support ARM-MDK and GNU software design tools.         Gowin Semiconductor provides customers the new generation FPGA development environment supporting GW1NS series FPGA SoC device, which addressed the market needs and fully proprietary by Gowin Semiconductor Corp. The new development environment can perform FPGA synthesis, place and route, bitstream file generation and download in an one-stop integrated environment.               “GW1NS is a true miniaturized FPGA-SoC system in one chip,” said by Mr. Jim Gao, Senior Manager of IP core R&D department, Gowin Semiconductor Corp, “GW1NS leverages the advantages of FPGA programmable features to enable customers to design the interfaces and peripherals they needs in different applications scenarios with the integrated 1.7K LUTs low power FPGA logics, and configure these peripherals with the embedded CPU. The device directly integrates the data processing function of CPU with low density FPGA into one FPGA SoC system; such integration opens a new frontier of FPGA applications and systemization.               “GW1NS-2 is the first devices in the FPGA industry to integrate Cortex-M3 MCU and 1.7K LUTs logic in a single FPGA SoC”, said by Mr. TP Wang, Vice President of Engineering, Gowin Semiconductor Corp, “Gowin Semiconductor innovatively introduces low-density, non-volatile, embedded flash memory FPGA devices into wide range of market such as consumer, industrial control, IoT, security and get tremendous success in the market. GW1NS-2 FPGA SoC device fully utilizes the complementary features of MCU and FPGA, together with flexible peripherals of USB PHY and ADC, which widely extends the FPGA markets and applications. The availability of GW1NS-2 is also the prologue of Gowin strategy on AI and the emerging edge computing market. GW1NS series is the ideal embedded processor solution with programmability to address the applications like pattern and voice recognition in AI and edge computing end points”   Gowin Semiconductor always focus on product advantages accumulation, innovation and differentiation”, said by Stanley Tse, Reginal Sales Director of Gowin Semiconductor Corp, “The official launches of GW1NS-2 is our first trial on SoC market with our proven success LittleBee™ FPGA family + ARM hardware architecture. With this based architecture, we integrate high speed MIPI DPHY, ADC and other applications modules; together with our advantages on small package and low cost. We are very confident on market acceptance of GW1NS-2 and create another tremendous success of LittleBee™ family in broad range of applications, e.g., video interface, smart connected devices, portable consumer and ioT, AI and edge computing end points.     About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., with headquarter and major R&D in China, our vision is to accelerate worldwide customers innovation by our programmable solution. We focus on optimizing our products and removing barriers for customers to use programmable logics devices. Our commitment to technology and quality enables customers to reduce total cost of ownership by using FPGA on their production boards. Our offering includes board portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs and development kits.  And we serves customers in consumer, industrial, communication, medical and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   @Copyright 2017 GOWIN Semiconductor Corp. GOWIN, LittleBee™, GW1N/NR, Arora™, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com  
NewTech1
2018-05-31
GOWIN Semiconductor Corp. Attends New-Tech 2018 in Tel Aviv, Israel Tel Aviv, Israel, May, 29, 2018 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, attends New-Tech Exhibition 2018 in Tel Aviv, Israel, with his distribution partner, Eldis Technology, to demonstrate Gowin latest FPGA technology. In the event, Gowin Semiconductor officially launches our leading FPGA products to Israel and Europe market with Eldis Technology. The New-Tech 2018 Exhibition is the largest and major exhibition of the hi-tech and electronics in Israel and attracts more than 25,000 professionals from Israel and Europe. As the first and sole China based FPGA company in the New-Tech 2018, Gowin demonstrates our leading MIPI I3C master and slave solution based on Gowin LittleBee® GW1N-9 device. The professionals attended to the show are impressed by Gowin leading technology and they are highly positive to experience a China based FPGA new comer. They are expecting Gowin and Eldis Technology can offer Israel and Europe market a new FPGA option with innovative technology and cost effective solution.
Gowin_FMA
2018-05-21
GOWIN Semiconductor Accelerates Growth with Opening of New North America Sales Office in Silicon Valley     The new office location enables GOWIN Semiconductor to accelerate marketing and sales growth in the Americas Region   SAN JOSE, CA  May 17, 2018 – GOWIN Semiconductor Corp., a leading provider of low power, small package, and performance driven Field Programmable Gate Arrays (FPGA), recently opened a sales office in Silicon Valley to accommodate the rapid growth of programmable logic devices used in consumer, communications, industrial, automotive, and medical marketplaces throughout the Americas Region.       In addition to the new office in Silicon Valley, GOWIN Semiconductor has signed on Fahrner-Miller Associates, an electronics manufacturers representative, to market and sell the complete line of FPGA products in Northern California and Northern Nevada.  This assignment helps to fast-track GOWIN’s presence and penetration into one of the worlds leading technical regions for development.   “The decision to expand our presence into North America has been on our roadmap for a long time as part of our business growth strategy, to complement our business success in Europe and Asia,” said Jason Zhu, CEO of GOWIN Semiconductor Corp.  “The Silicon Valley area is rich with opportunities today that can take advantage of GOWIN’s product value.  As we grow further in the region, we will leverage the vast talent pool located here and elsewhere to aid in our expansion.”   “I am honored and excited to lead the marketing and sales team enabling growth,” said Scott Casper, Director of Sales, Americas.  “Silicon Valley is an important area for us to start our expansion plans into the North America target markets. With our products, we look forward to participating in the technology advancements here.”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in USA and China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com
GOWIN Eldis
2018-03-27
GOWIN Semiconductor Corp. Appoints Eldis Technology as Distributor in Israel Guangzhou, China, March 27, 2018 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces appointing Eldis Technology Ltd as distributor in Israel. The appointment represents that Gowin further expands her products offering to Europe, after establishing sales network in Asia   “We are excited to appoint Eldis Technology as our distributor in Israel. Eldis Technology has strong technical expertise and customer bases in telecommunication, computing storage, security and medical segments such as ECI, Checkpoint and many others leading manufacturers world-wide,” said by Stanley Tse, Regional Sales Director of Gowin Semiconductor Corp. “The partnership with Eldis Technology will accelerate Gowin products design wins into global market leaders after our tremendous success in Asia. Besides our strong shipment in China, we have built up outstanding design pipeline in Korea and Taiwan after we have setup distributors there in less than 6 months. Now we are expecting these track record happened in Israel and Europe again with Eldis together.  And most importantly, Gowin shares the same business philosophy with Eldis - we pride ourselves on our ability to meet and exceed our customers’ diverse expectations”   “We are very pleased and excited to have Gowin line added to our portfolio,” said Dov Armon , C.E.O of Eldis Technologies . “There is a clear synergy between our current line card and Gowin, We quite often see FPGA employed in our designs on the same board. I am confident that our customers will benefit of Gowin technology combined with Eldis support in terms of enjoying Gowin quality and shorten Time-To-Market. The Israel fast-growing market and the many start-ups continuously looking for new and exciting solutions. It is also of our team’s intention to use our position as a leading distributor to open the door for Gowin to penetrate into more European territories”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   About Eldis Technologies Ltd. Founded in 1991, headquartered in Herzeliya, Eldis Technologies is a leading sales, marketing and technical consulting organization specializing in high-performance microchips and related products for the Israeli Telecommunications, Defense and Medical industry. Eldis Technologies is the Israeli technical representatives and distributor of some of the leading international manufacturers of Semiconductors and components for Telecom, Datacom, networking and System on Chip based systems. Eldis offers a global service, from technical support and field application engineering through logistics and contracts. As specialized sales representatives of sophisticated integrated circuit based products, Eldis applies strategic sales and marketing models geared specifically to the Israeli market and to the advanced nature of its product line. Eldis also operates a New York based subsidiary operates as its logistics hub. For more information about ELDIS, please visit www.eldis.co.il     @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com  
HK Office
2018-03-12
GOWIN Semiconductor Corp. Announces Opening New Technology Center in Hong Kong Science and Technology Parks of Hong Kong GOWIN Semiconductor Corp. Announces Opening New Technology Center in Hong Kong Science and Technology Parks of Hong Kong       Hong Kong, China March 12th, 2018 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces opening new technology center in Hong Kong. The new technology center is located in Lakeside 2, Phase 2 of Hong Kong Science and Technology Parks and it will be the fifth R&D centers of Gowin Semiconductor after Jinan, Shanghai, Guangzhou of China and San Jose of US.   “We are excited to open our fifth technology center in Hong Kong Science Parks and the center will play an indispensable role to support our international customers and partners on innovative technology development with Gowin products and solutions” said by Jason Zhu, CEO of Gowin Semiconductor Corp. “As a technology driven company, Gowin will develop a high quality engineering team in Hong Kong. We choose the location in HKSTP as we believe that the living environment in Hong Kong can attract high quality engineers to work in here. And as a China based leading FPGA company, Gowin also has social responsibility to cultivate the Hong Kong graduates to be semiconductor professionals, aligning with the National developm,ent strategy on semiconductor industry of China.”   “As a grown-up in Hong Kong, I am very honor to lead and develop the technology center in Hong Kong,” continued by Stanley Tse, General Manager of Hong Kong Gowin Semiconductor, “Developing tech high industry in Hong Kong is one of the most important strategies in the latest Chief Executive Policy Address of HKSAR; and Gowin selects Hong Kong to be our fifth technology center emphasizing our support to the high tech strategy of HKSAR.  The location of HKSTP can bridge us not only with Hong Kong local technology industry and institutions; but also with our international customers and technology partners; this is essential to Gowin as we are developing world wide FPGA ecosystem in fast paces. In fact, we are already working on an emerging application with a Hong Kong based leading semiconductor company, also with their R&D center in HKSTP. This application is based on our newly released I3C IP as Gowin Semiconductor is the only FPGA supplier in the semiconductor industry who can provide I3C master and slaves IP on silicon devices to customers. With our technology center opened in HKSTP, we are expecting rapid growing on such emerging technology cooperation with the industry.”           About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com       @Copyright 2018 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com  
I3C Block Diagram
2018-01-09
GOWIN Semiconductor Corp. Announces MIPI I3C Standardized Sensor Interface Solution JiNan, China, Jan 10th, 2018 – GOWIN Semiconductor Corp., the World’s leading non-volatile-technology programmable logic device provider, today announces SDR-Mode (Single-Data-Rate) MIPI I3C Standardized Sensor Interface Solution – A High-Speed Serial Interface IP (Master-Slave-Combined). The solution is based on GOWIN LittleBeeÒ family GW1N-9 device, including IP core, reference design and development board as a total solution.               I3C is a new generation two-wire serial bus interface developed by MIPI Alliance Sensor Working Group and collaborated by industry-wide sensor chip makers, IP companies and Top-Tier ODMs in mobile and embedded markets. I3C is targeted to be a fundamental interface for mobile, embedded system and IoT applications; it is an extension of former I2C standard and downward compatible. GOWIN Semiconductor Corp, a member of MIPI Alliance, offers the GWI3C IP solution, which is fully compliant with MIPI Alliance’s I3C standard. The IP can be dynamically configured to be I3C Master or I3C Slave, implemented within GW1N family FPGA, for communicating seamlessly with any other devices compliant with MIPI Alliance SWG I3C and I2C standard.               “As the first China-based MIPI Alliance member and leading FPGA supplier, GOWIN Semiconductor Corp. is committed to deliver the latest technology to our customer,” Stanley Tse, Regional Sales Director (Asia) of GOWIN Semiconductor Corp. “The GWI3C IP that GOWIN announces today supports SDR-Mode (Single-Data-Rate) and we will support DDR-Mode (Double-Data-Rate) to achieve much higher transfer data rate up to 33Mbps in future release. The current release is downward-compatible with I2C protocol and able to connect I2C slave devices directly, while we will extend to support I3C-To-SPI and I3C-To-UART bridging in next release. The GOWIN I3C-ECO-IP package will contain full features set including I3C-Master-Salve-Combined, I2C-Master-Salve-Combined, I3C2SPI-bridge, I3C2UART-bridge, SPI-Master-Salve-Combined, and UART-Host-Device-Combined in its upcoming versions. Therefore, our customer can implement the I3C Master function within GW1N FPGA family device to communicate with other SPI-Slave and UART devices in the same system directly. This enables customer to adopt the latest high-speed, low-power I3C technology immediately to enhance their products performance, while still able to connect with low cost and legacy SPI/UART sensors or other I2C slave devices in the same system. Thus, fulfills GOWIN’s commitment to the industry: accelerate customer innovation with competitive cost.”             Dr. Song, Ning, CTO & President of GOWIN Semiconductor Corp. continued to comment, “Our GWI3C IP implemented on GOWIN LittleBeeÒ family FPGA has the advantages of utilizing low pin count on and enhances features-to-cost ratio. It significantly reduces the number of physical ports connecting to devices in today’s electrical system. In addition, the GWI3C system has features of higher data transfer rate, backward compatible with existing bus protocols, while still able to keep the whole system at low power. All these meet the exact key design criteria in today mobile devices, ADAS and IoT applications.”   I3C Typical Application Motion sensing (gyro, accelerometer) Environment perceptional sensing (sounds, light, temperature, humidity) Bionics sensing (fingerprint, heart rate monitoring, respiratory frequency) Communication (NFC, IrDA)   GWI3C Basic Features Feasible and programmable: support adjustable data and clock duty cycle in high precision, to achieve wide range data transmission rate, Support static addressing Support dynamic addressing Support I3C address arbitration Single Data Rate (SDR)   GWI3C Advanced Features Support hot-socket Support dynamic addressing in hot-socket Supports Slave requests Secondary Master (SDR-only) Support In-band Interrupts Support Common Command Code (CCC)   GW13C Transmission Rate             GOWIN YunYuanÒ EDA fully automates the GWI3C IP (Master-Slave-Combined) design integration with user application. GWI3C IP (SDR-mode) supports data rate up to 12.5Mbps.    GW1N-9 FPGA             GW1N-9 IO block integrates a new enhanced configuration IO circuitry which is designed to meet MIPI I3C specification; and these enhanced IO circuitry is on two banks of GW1N-9 IO blocks. Users do not need to make any change on software when using such enhanced IO circuitry. The only thing need to do is to enable I3C mode in the PNR constraints for GOWIN YunYuanÒ EDA.   GWI3C IP Development Board and Reference Design On top of GWI3C IP, GOWIN provides full function I3C development board for customer to develop I3C application off the shelf. Moreover, the I3C development board is designed to be stackable and can be used to communicate with multiple devices at the same I3C bus.         About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world-wide with programmable solutions. We focus on optimizing our products and removing barriers for customers in using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   @Copyright 2017 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN YunYuan and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com