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GOWIN SEMICONDUCTOR CORP. ATTENDS MIP DEVCON, SEOUL 2018
2018-10-21

Guangzhou, China, October 21, 2018 – Gowin Semiconductor Corp., the leading programmable logic devices provider in China, attended MIPI DevCon Seoul 2018 on 19 October 2018 at Millennium Seoul Hilton and demonstrated Gowin industry leading I3C solution based on Gowin LittleBee® family GW1N9 devices.

 

MIPI DevCon is the annual conference organized by MIPI Alliance and tailored to developers who are interfacing sensors in mobile, IoT or automotive designs, or integrating and testing imaging, displays and touch components in connected cameras, tablets, laptops and other devices. MIPI DevCon Seoul brings the latest information on MIPI specifications to developers in the region.

 Self Photos / Files - MIPI DevCon 2018

As member of MIPI Alliance, Gowin Semiconductor is invited to demonstrate her industry leading I3C solution in the event. The I3C demo is based on Gowin low power, non-volatile LittleBee™ family GW1N-9 device and GOWIN I3C-ECO-IP package to provide I3C Master and I3C Slave solution. GW1N-9 is the first product in the FPGA industry supported MIPI I3C and MIPI D-PHY GPIO standard; and GOWIN I3C-ECO-IP package is fully compliant with MIPI Alliance’s I3C standard. The current version of GOWIN I3C-ECO-IP package supports SDR-Mode (Single-Data-Rate) and will support DDR-Mode (Double-Data-Rate) with full features set including I3C-Master-Salve-Combined, I2C-Master-Salve-Combined, I3C2SPI-bridge, I3C2UART-bridge, SPI-Master-Salve-Combined, and UART-Host-Device-Combined in its upcoming versions.

 

 

“We are excited to be invited to demonstrate our industry leading I3C solution in the MIPI DevCon Seoul,” said by Stanley Tse, Regional Sales Director of Gowin Semiconductor Corp., “Gowin Semiconductor is the first FPGA supplier in the industry to provide MIPI leading I3C solution to market and we have tremendous success since we launched our solution this January. We provide the most cost effective, low power, programmable and easy to use I3C solution in silicon to enable customers to validate their I3C slave chipsets with Gowin  GW1N-9 devices and GOWIN I3C-ECO-IP package . Customers around the world including United States, China, Europe, Korea, Taiwan, South East Asia are using Gowin I3C solution to accelerate their products launched to market. In this MIPI DevCon, we are excited to see that I3C is being the emerging standard in mobile, wearable and iOT application and extending to automotive and other market segment driven by MIPI Alliance; and we, Gowin Semiconductor, is honor to accelerate the market adoption of I3C with our leading FPGA products and solution.”

 

About GOWIN Semiconductor Corp.

Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

For more information about Gowin, please visit www.gowinsemi.com

 

 

 

@Copyright 2018 GOWIN Semiconductor Corp. Gowin, LittleBee®, GW1N/NR®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of Gowin Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners.

For more information, please email info@gowinsemi.com