ABOUT US

Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

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MARKET
commun
COMMUNICATION
Connected to the Future.  From Gbps Ethernet to 5G, GOWIN offers full product portfolio of low power, high-speed interface and small footprint FPGA to meet communication equipment makers’ demand on time-to-market and reduce total...
industry
INDUSTRIAL
Smart, Connected and Green! Industry 4.0 requires machines to be intelligent, connected and energy saving.  Our low power, embedded DDR/SDRAM and high performance DSP , GOWIN FPGA enables industrial manufacturers from industrial...
auto
AUTOMOTIVES
Intelligent, Connected and Safe! Smart and safe driving are today automotive market trends and Advanced Driving Assistance System (ADAS) requires more sensors to be connected in car. GOWIN FPGA provides high IO counts in small form factor...
consumer
CONSUMER
Accelerate your Innovation.  Product differentiation and time-to-market are the critical success factors in today high competitive consumer marketplace.  GOWIN’s low cost, high performance FPGA with our on-the-shelf IP solutions is the answer...
medical
MEDICAL
Visual, Portable and Reliable. The semiconductor contents continue to increase in medical devices and systems as the emerging technology of MEMS and sensor.  Higher resolution of image sensor drives increased resolution, larger size and...
cloud
CLOUD COMPUTING AND DATA CENTERS
High Performance and Programmability. The emerging cloud computing market drives higher performance and programmability of computing and storage devices in data center everyday. With abundant logic and DSP resources, GOWIN AroraTM ...
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NEWS
I3C Block Diagram
2018-01-09
GOWIN Semiconductor Corp. Announces MIPI I3C Standardized Sensor Interface Solution
JiNan, China, Jan 10th, 2018 – GOWIN Semiconductor Corp., the World’s leading non-volatile-technology programmable logic device provider, today announces SDR-Mode (Single-Data-Rate) MIPI I3C Standardized Sensor Interface Solution – A High-Speed Serial Interface IP (Master-Slave-Combined). The solution is based on GOWIN LittleBeeÒ family GW1N-9 device, including IP core, reference design and development board as a total solution.               I3C is a new generation two-wire serial bus interface developed by MIPI Alliance Sensor Working Group and collaborated by industry-wide sensor chip makers, IP companies and Top-Tier ODMs in mobile and embedded markets. I3C is targeted to be a fundamental interface for mobile, embedded system and IoT applications; it is an extension of former I2C standard and downward compatible. GOWIN Semiconductor Corp, a member of MIPI Alliance, offers the GWI3C IP solution, which is fully compliant with MIPI Alliance’s I3C standard. The IP can be dynamically configured to be I3C Master or I3C Slave, implemented within GW1N family FPGA, for communicating seamlessly with any other devices compliant with MIPI Alliance SWG I3C and I2C standard.               “As the first China-based MIPI Alliance member and leading FPGA supplier, GOWIN Semiconductor Corp. is committed to deliver the latest technology to our customer,” Stanley Tse, Regional Sales Director (Asia) of GOWIN Semiconductor Corp. “The GWI3C IP that GOWIN announces today supports SDR-Mode (Single-Data-Rate) and we will support DDR-Mode (Double-Data-Rate) to achieve much higher transfer data rate up to 33Mbps in future release. The current release is downward-compatible with I2C protocol and able to connect I2C slave devices directly, while we will extend to support I3C-To-SPI and I3C-To-UART bridging in next release. The GOWIN I3C-ECO-IP package will contain full features set including I3C-Master-Salve-Combined, I2C-Master-Salve-Combined, I3C2SPI-bridge, I3C2UART-bridge, SPI-Master-Salve-Combined, and UART-Host-Device-Combined in its upcoming versions. Therefore, our customer can implement the I3C Master function within GW1N FPGA family device to communicate with other SPI-Slave and UART devices in the same system directly. This enables customer to adopt the latest high-speed, low-power I3C technology immediately to enhance their products performance, while still able to connect with low cost and legacy SPI/UART sensors or other I2C slave devices in the same system. Thus, fulfills GOWIN’s commitment to the industry: accelerate customer innovation with competitive cost.”             Dr. Song, Ning, CTO & President of GOWIN Semiconductor Corp. continued to comment, “Our GWI3C IP implemented on GOWIN LittleBeeÒ family FPGA has the advantages of utilizing low pin count on and enhances features-to-cost ratio. It significantly reduces the number of physical ports connecting to devices in today’s electrical system. In addition, the GWI3C system has features of higher data transfer rate, backward compatible with existing bus protocols, while still able to keep the whole system at low power. All these meet the exact key design criteria in today mobile devices, ADAS and IoT applications.”   I3C Typical Application Motion sensing (gyro, accelerometer) Environment perceptional sensing (sounds, light, temperature, humidity) Bionics sensing (fingerprint, heart rate monitoring, respiratory frequency) Communication (NFC, IrDA)   GWI3C Basic Features Feasible and programmable: support adjustable data and clock duty cycle in high precision, to achieve wide range data transmission rate, Support static addressing Support dynamic addressing Support I3C address arbitration Single Data Rate (SDR)   GWI3C Advanced Features Support hot-socket Support dynamic addressing in hot-socket Supports Slave requests Secondary Master (SDR-only) Support In-band Interrupts Support Common Command Code (CCC)   GW13C Transmission Rate             GOWIN YunYuanÒ EDA fully automates the GWI3C IP (Master-Slave-Combined) design integration with user application. GWI3C IP (SDR-mode) supports data rate up to 12.5Mbps.    GW1N-9 FPGA             GW1N-9 IO block integrates a new enhanced configuration IO circuitry which is designed to meet MIPI I3C specification; and these enhanced IO circuitry is on two banks of GW1N-9 IO blocks. Users do not need to make any change on software when using such enhanced IO circuitry. The only thing need to do is to enable I3C mode in the PNR constraints for GOWIN YunYuanÒ EDA.   GWI3C IP Development Board and Reference Design On top of GWI3C IP, GOWIN provides full function I3C development board for customer to develop I3C application off the shelf. Moreover, the I3C development board is designed to be stackable and can be used to communicate with multiple devices at the same I3C bus.         About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world-wide with programmable solutions. We focus on optimizing our products and removing barriers for customers in using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com   @Copyright 2017 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN YunYuan and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com
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车用级芯片-B-2
2017-11-30
GOWIN Semiconductor Corp. Announces Automotive Grade Devices Targeting to Automotive Market
Guangdong, China Nov 30th, 2017 – GOWIN Semiconductor Corp., the leading programmable logic devices provider in China, today announces automotive temperature grade devices of the non-volatile LittleBee®  product family. GOWIN LittleBeeÒ FPGA family is based on 55nm embedded flash non-volatile technology, which has been offering industrial temperature range (-40°C ~ +100°C) devices to the market since it was launched in 2016; and now extend the offering to automotive temperature grade (-40°C ~ +125°C) for selected devices of the family. GOWIN LittleBee® non-volatile FPGA family has incomparable features including low power, high IO counts, abundant logic resources, high speed LVDS and supports random access mode of user flash; all these features enable LittleBee® family quickly adopt by customers in industrial and consumer market since it was launched in 2016. Besides, GOWIN LittleBee® family is the first FPGA in the industry to support the leading I3C standard from MIPI Alliance Sensor Working Group and able to use its GPIO to implement MIPI D-PHY standard. The latest I3C specification supports Push-Pull SDR (Single-Data-Rate), HDR-DDR mode (High-Data-Rate Double-Data-Rate) and the highest data rate can achieve 12.5Mbps. The GPIO of GOWIN LittleBee® GW1N devices integrates circuitry to support MIPI HS/LP mode switching, which removes the external matching resistors, significantly reduces the PCB design complexity and increase system reliability.   “The introduction of automotive temperature range devices to market today is just the first step to show GOWIN’s commitment on automotive market,” said by Mr. Zhaolin Wu, Director of Operation and Manufacturing, GOWIN Semiconductor Corp. “We have also kicked-off the complete automotive grade product supply chain qualification process including AEC-Q100, Zero Defect and ISO/TS16949 certification. As all the GOWIN’s manufacturing partners already have these certification, we are confident to offer the market our automotive grade devices in very near future.” “Automotive market is one of the focus and fast growing segments in semiconductor industry. The CAGR of semiconductor revenue in this market is over 10% world wide and up to 20% in Asia,” Mr. Stanley Tse, Regional Sales Director (Asia) of GOWIN Semiconductor Corp., continues to comment, “however, there are only a few semiconductor suppliers are willing and able to commit to this market as it requires long term and high investment on the product development and whole supply chain. GOWIN Semiconductor Corp., as the leading China based FPGA supplier, we are confident and commit to the automotive market. We see that FPGA is moving from peripheral to core component in automotive applications while ADAS, high end In-vehicle Infotainment, functional safety and electronic vehicles are getting popular in the market. All these applications require programmability and parallel processing, which is the sweet-pot of FPGA. We are highly confident that our Return-On-Investment will be fully justified by the emerging FPGA opportunities in the automotive market.”   About GOWIN Semiconductor Corp. Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide. For more information about GOWIN, please visit www.gowinsemi.com       @Copyright 2017 GOWIN Semiconductor Corp. GOWIN, LittleBee, GW1N/NR, Arora, GW2A/AR, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are property of their respective owners. For more information, please email info@gowinsemi.com  
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Oct 17 Conference
2017-11-02
Short Video of Gowin Semiconductor 2017 Shanghai Conference in 2 minutes
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